SPRING FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICE
A MEMS device ( 20 ) includes a substrate ( 28 ) and a drive mass ( 30 ) configured to undergo oscillatory motion within a plane ( 24 ) substantially parallel to a surface ( 50 ) of the substrate ( 28 ). The sensor ( 20 ) further includes drive springs ( 56 ), each of which includes a principal beam ( 70 ) and a flexion beam ( 72 ) coupled an end ( 74 ) of the principal beam ( 70 ). The flexion beam ( 72 ) is anchored to the drive mass ( 30 ) or the substrate ( 28 ). The flexion beam ( 72 ) exhibits a width ( 90 ) that is less than a width ( 88 ) of the principal beam ( 70 ). In response to oscillatory drive motion, the flexion beam ( 72 ) flexes so that the principal beam ( 70 ) rotates about a pivot point ( 96 ) within the plane ( 24 ). Thus, out-of-plane movement of the drive mass ( 30 ) is reduced thereby suppressing quadrature error.
1 . A microelectromechanical systems (MEMS) device comprising:
a substrate having a surface;
a drive mass configured to undergo oscillatory motion within a plane substantially parallel to said surface; and
drive springs, each of said drive springs including a first beam and a second beam coupled to an end of said first beam, said second beam being anchored to one of said drive mass and said substrate, said first beam exhibiting a first width substantially parallel to said plane, and said second beam exhibiting a second width substantially parallel to said plane, said second width being less than said first width.
2 . A MEMS device as claimed in claim 1 wherein a first lengthwise dimension of said first beam is oriented approximately perpendicular to a second lengthwise dimension of said second beam.
3 . A MEMS device as claimed in claim 1 wherein said end of said first beam is coupled to a midpoint of said second beam relative to a lengthwise dimension of said second beam.
4 . A MEMS device as claimed in claim 1 wherein an intersection of said second beam with said first beam forms a pivot point, and said second beam flexes to enable pivotal motion of said first beam within said plane about said pivot point in response to said oscillatory motion.
5 . A MEMS device as claimed in claim 4 wherein said second beam includes:
a first flex element, said first flex element flexing in a first direction in response to said oscillatory motion; and
a second flex element, said end of said first beam being interposed between said first and second flex elements, said second flex element flexing in a second direction that is opposite to said first direction, said first and second flex elements flexing in response to said oscillatory motion.
6 . A MEMS device as claimed in claim 1 wherein said end is a first end, and said each of said drive springs further comprises a third beam coupled to a second end of said first beam, said third beam exhibiting a third width substantially parallel to said plane that is less than said first width.
7 . A MEMS device as claimed in claim 6 further comprising a suspended mass, said third beam being anchored to said suspended mass.
8 . A MEMS device as claimed in claim 6 wherein said third width is approximately equivalent to said second width.
9 . A MEMS device as claimed in claim 6 wherein said third beam is oriented approximately parallel said second beam.
10 . A MEMS device as claimed in claim 6 wherein a second lengthwise dimension of said second beam is approximately equivalent to a third lengthwise dimension of said third beam.
11 . A MEMS device as claimed in claim 1 wherein said drive mass is configured to undergo said oscillatory motion in a linear drive direction that is substantially parallel to said surface of said substrate, and a lengthwise dimension of said first beam is oriented approximately perpendicular to said drive direction.
12 . A MEMS device as claimed in claim 11 wherein said lengthwise dimension is a first lengthwise dimension, and a second lengthwise dimension of said second beam is oriented approximately parallel to said linear drive direction.
13 . A MEMS device as claimed in claim 1 wherein said drive mass is configured to undergo said oscillatory motion about a drive axis that is substantially perpendicular to said surface of said substrate, and a lengthwise dimension of said first beam is radially oriented relative to said drive axis.
14 . A MEMS device as claimed in claim 13 wherein said lengthwise dimension is a first lengthwise dimension, and a second lengthwise dimension of said second beam is approximately tangentially oriented relative to said drive axis.
15 . A microelectromechanical systems (MEMS) device comprising:
a substrate having a surface;
a drive mass configured to undergo oscillatory motion within a plane substantially parallel to said surface;
a suspended mass; and
drive springs connecting said suspended mass with said drive mass, each of said drive springs including a first beam and a second beam coupled to an end of said first beam, said second beam being anchored to one of said drive mass and said suspended mass, said first beam exhibiting a first width substantially parallel to said plane, and said second beam exhibiting a second width substantially parallel to said plane, said second width being less than said first width, wherein an intersection of said second beam with said first beam forms a pivot point, and said second beam flexes to enable pivotal motion of said first beam within said plane about said pivot point in response to said oscillatory motion.
16 . A MEMS device as claimed in claim 15 wherein said end is a first end, and said each of said drive springs further comprises a third beam coupled to a second end of said first beam, said third beam being anchored to the other of said drive mass and said suspended mass, said third beam exhibiting a third width substantially parallel to said plane that is less than said first width.
17 . A MEMS device as claimed in claim 15 wherein said drive mass is configured to undergo said oscillatory motion in a linear drive direction that is substantially parallel to said surface of said substrate, a first lengthwise dimension of said first beam is oriented approximately perpendicular to said drive direction, and a second lengthwise dimension of said second beam is oriented approximately parallel to said linear drive direction.
18 . A MEMS device as claimed in claim 15 wherein said drive mass is configured to undergo said oscillatory motion about a drive axis that is substantially perpendicular to said surface of said substrate, a first lengthwise dimension of said first beam is radially oriented relative to said drive axis, and a second lengthwise dimension of said second beam is approximately tangentially oriented relative to said drive axis.
19 . A microelectromechanical systems (MEMS) device comprising:
a substrate having a surface;
a drive mass configured to undergo oscillatory motion within a plane substantially parallel to said surface;
a suspended mass; and
drive springs connecting said suspended mass with said drive mass, each of said drive springs including:
a first beam exhibiting a first width substantially parallel to said plane;
a second beam coupled to a first end of said first beam, said second beam being anchored to said drive mass, said second beam exhibiting a second width substantially parallel to said plane, said second width being less than said first width; and
a third beam coupled to a second end of said first beam, said third beam being anchored to said suspended mass, said third beam exhibiting a third width substantially parallel to said plane, said third width being less than said first width, wherein in response to said oscillatory motion, said second width of said second beam and said third width of said third beam enable flexion of said second and third beams relative to said first beam so that motion of said first beam occurs substantially within said plane.
20 . A MEMS device as claimed in claim 19 wherein:
said third beam is oriented approximately parallel said second beam; and
said first beam is oriented approximately perpendicular to said second and third beams.