Epitaxial silicon carbide single crystal substrate and process for producing the same
View Patent ↗Provided is an epitaxial silicon carbide single-crystal substrate in which a silicon carbide epitaxial film having excellent in-plane uniformity of doping density is disposed on a silicon carbide single-crystal substrate having an off angle that is between 1° to 6°. The epitaxial film is grown by repeating a dope layer that is 0.5 μm or less and a non-dope layer that is 0.1 μm or less. The dope layer is formed with the ratio of the number of carbon atoms to the number of silicon atoms (C/Si ratio) in a material gas being 1.5 to 2.0, and the non-dope layer is formed with the C/Si ratio being 0.5 or more but less than 1.5. The resulting epitaxial silicon carbide single-crystal substrate comprises a high-quality silicon carbide epitaxial film, which has excellent in-plane uniformity of doping density, on a silicon carbide single-crystal substrate having a small off angle.
1. An epitaxial silicon carbide single crystal substrate, comprising:
a silicon carbide single crystal substrate having an off-angle of 1 to 6°, and a silicon carbide epitaxial film formed on the silicon carbide single crystal substrate by use of a chemical vapor deposition method,
wherein the epitaxial film has two or more doped layers and two or more non-doped layers, and is formed by alternately stacking a doped layer having a thickness of 0.5 μm or less and being formed while adding an impurity element; and a non-doped layer having a thickness of 0.1 μm or less and being formed without the addition of an impurity element, in order of the non-doped layer and the doped layer from the silicon carbide single crystal substrate,
wherein the doped layer is formed by setting the ratio of numbers of carbon and silicon atoms (C/Si) contained in a raw material gas for epitaxial film to be 1.5 or more and 2.0 or less, and the non-doped layer is formed by setting the ratio of numbers of carbon and silicon atoms (C/Si) contained in a raw material gas for epitaxial film to be 0.5 or more and less than 1.5,
wherein the thickness of the doped layer is larger than the thickness of the non-doped layer, and
wherein the density of doping atom number of the doped layer is 1×10 15 cm −3 to 1×10 17 cm −3 .
2. A process for producing an epitaxial silicon carbide single crystal substrate by forming a silicon carbide epitaxial film on a silicon carbide single crystal substrate having an off-angle of 1 to 6° by use of a chemical vapor deposition method; the process comprising alternately the steps of:
growing a doped layer having a thickness of 0.5 μm or less, and being formed while adding an impurity element by setting the ratio of numbers of carbon and silicon atoms (C/Si) contained in a raw material gas for epitaxial film to be 1.5 or more and 2.0 or less, and
growing a non-doped layer having a thickness of 0.1 μm or less, and being formed without the addition of an impurity element by setting the ratio of numbers of carbon and silicon atoms (C/Si) contained in a raw material gas for epitaxial film to be 0.5 or more and less than 1.5, to thereby form a silicon carbide epitaxial film having two or more doped layers and two or more non-doped layers in order of the non-doped layer and the doped layer from the silicon carbide single crystal substrate,
wherein the thickness of the doped layer is larger than the thickness of the non-doped layer, and
wherein the density of doping atom number of the doped layer is 1×10 15 cm −3 to 1×10 17 cm 3 .