Aluminum copper clad material
An aluminum copper clad material has excellent bonding strength and includes an aluminum layer and a copper layer that are bonded without a nickel layer interposed therebetween. The aluminum layer and the copper layer are diffusion-bonded via an Al—Cu intermetallic compound layer. The copper layer satisfies Dcs≦0.5×Dcc, where Dcc represents the average crystal grain size of crystal grains in a central portion in the thickness direction of the copper layer, and Dcs represents the average crystal grain size of an interface adjacent portion C 2 in the copper layer that is about 0.5 μm apart from the interface between the copper layer and the intermetallic compound layer. The intermetallic compound layer has an average thickness of about 0.5 μm to about 10 μm.
1. An aluminum copper clad material comprising:
an aluminum layer;
a copper layer; and
an Al—Cu intermetallic compound layer; wherein
the aluminum layer and the copper layer are diffusion-bonded via the Al—Cu intermetallic compound layer;
the copper layer satisfies Dcs≦0.5×Dcc, where Dcc represents an average crystal grain size of crystal grains in a central portion in a thickness direction of the copper layer, and Dcs represents an average crystal grain size of an interface adjacent portion in the copper layer that is about 0.5 μm apart from an interface between the copper layer and the intermetallic compound layer; and
the intermetallic compound layer has an average thickness of about 0.5 μm to about 10 μm and includes broken up and dispersed aluminum oxide.
2. The aluminum copper clad material according to claim 1 , wherein
the average crystal grain size Dcs of the interface adjacent portion satisfies Dcs≦0.4×Dcc.
3. The aluminum copper clad material according to claim 1 , wherein the average thickness of the intermetallic compound layer is about 1.0 μm to about 5.0 μm.
4. The aluminum copper clad material according to claim 1 , wherein the aluminum layer is made of pure aluminum or an aluminum alloy having an electric conductivity of about 10% IACS or greater, and the copper layer is made of pure copper or a copper alloy having an electric conductivity of about 10% IACS or greater.
5. The aluminum copper clad material according to claim 1 , wherein the aluminum layer and the copper layer each have a thickness of about 0.1 mm to about 2 mm.
6. An aluminum copper clad material comprising:
an aluminum layer;
a copper layer; and
an Al—Cu intermetallic compound layer; wherein
the aluminum layer and the copper layer are diffusion-bonded via the Al—Cu intermetallic compound layer;
the aluminum layer satisfies Das≦0.5×Dac, where Dac represents an average crystal grain size of crystal grains in a central portion in a thickness direction of the aluminum layer, and Das represents an average crystal grain size of an interface adjacent portion in the aluminum layer that is about 0.5 μm apart from an interface between the aluminum layer and the intermetallic compound layer; and
the intermetallic compound layer has an average thickness of about 0.5 μm to about 10 μm and includes broken up and dispersed aluminum oxide.
7. The aluminum copper clad material according to claim 6 , wherein
the average crystal grain size Das of the interface adjacent portion satisfies Das≦0.4×Dac.
8. The aluminum copper clad material according to claim 6 , wherein the average thickness of the intermetallic compound layer is about 1.0 μm to about 5.0 μm.
9. The aluminum copper clad material according to claim 6 , wherein the aluminum layer is made of pure aluminum or an aluminum alloy having an electric conductivity of about 10% IACS or greater, and the copper layer is made of pure copper or a copper alloy having an electric conductivity of about 10% IACS or greater.
10. The aluminum copper clad material according to claim 6 , wherein the aluminum layer and the copper layer each have a thickness of about 0.1 mm to about 2 mm.