Voice film of multi-layered structure for flat type speaker
The present invention relates to a voice film having a multi-layered structure for a flat panel speaker, including a PCB configured to have permanent magnets disposed on the left and right sides thereof, to have a voice coil patterned therein and disposed between the permanent magnets on the left and right sides so that the voice coil is vibrated up and down, and to have a PCB structure of a stack structure and coil patterns formed on surfaces of the highest PCB, one or more intermediate layer PCBs, and the lowest PCB in the form of a consecutive spiral track, wherein the start points of coil patterns of adjacent PCBs formed in layers, from among the coil patterns, are shorted through a via hole and are bonded to the respective end points of the coil patterns of the adjacent PCBs at the end points of the coil patterns.
1. A multi-layered voice film for a flat panel speaker
comprising:
a Printed Circuit Board (PCB) structure including a stack structure of a highest PCB, one or more intermediate layer PCBs, and a lowest PCB,
coil patterns of a consecutive spiral track form are formed on surfaces of the highest PCB, one or more of the intermediate layer PCBs, and the lowest PCB, and
the coil patterns formed in each layer are bonded together through a via hole of an adjacent PCB.
2. The multi-layered voice film according to claim 1 , wherein the PCB layer having the stack structure is a 4-degree or higher layer.
3. The multi-layered voice film according to claim 1 , wherein each of the coil patterns comprises:
straight type pattern parts arranged in parallel, and
curved pattern parts each configured to couple the straight type pattern parts.
4. The multi-layered voice film according to claim 1 , wherein a start point of the coil pattern of the highest PCB is connected to a first power source line, and an end point of the coil pattern of the lowest PCB is connected to a second power source line.
5. A multi-layered voice film for a flat panel speaker
comprising:
a Printed Circuit Board (PCB) structure of a stack structure of a highest PCB, one or more intermediate layer PCBs, and a lowest PCB,
coil patterns formed on surfaces of the highest PCB, one or more of the intermediate layer PCBs, and the lowest PCB in a consecutive spiral track form, so that an N-degree (N is an integer) layer is formed,
wherein the coil patterns are shorted through via holes at start points of coil patterns by an N/2-degree layer between adjacent PCBs and are bonded to respective end points of coil patterns formed in N/2-degree layers of other adjacent PCBs at the end points of the coil patterns.
6. The multi-layered voice film according to claim 5 , wherein the PCB layer having the stack structure is a 4-degree or higher layer.
7. A multi-layered voice film for a flat panel speaker
comprising:
a Printed Circuit Board (PCB) structure of a stack structure of a highest PCB, one or more intermediate layer PCBs, and a lowest PCB,
coil patterns formed on surfaces of the highest PCB, one or more of the intermediate layer PCBs, and the lowest PCB in a consecutive spiral track form, so that an N-degree (N is an integer) layer is formed,
wherein adjacent coil patterns of the coil patterns are shorted through via holes at start points of the coil patterns in pairs and are bonded to respective end points of coil patterns of adjacent another pair of PCBs at the end points of the coil patterns.
8. The multi-layered voice film according to claim 7 , wherein the PCB layer having the stack structure is a 4-degree or higher layer.
9. A multi-layered voice film for a flat panel speaker
comprising:
a Printed Circuit Board (PCB) structure of a stack structure of a highest PCB, one or more intermediate layer PCBs, and a lowest PCB,
coil patterns formed on surfaces of the highest PCB, one or more of the intermediate layer PCBs, and the lowest PCB in a consecutive spiral track form, so that an N-degree (N is an integer) layer is formed,
wherein start points of coil patterns formed in two or more PCBs, from among the coil patterns, are shorted through via holes at start points of the coil patterns, and end points of the coil patterns formed in the respective PCBs are bonded to end points of coil patterns formed on other adjacent PCBs.
10. The multi-layered voice film according to claim 9 , wherein the PCB layer having the stack structure is a 4-degree or higher layer.