Sensor
An apparatus including: a transparent substrate including a first surface and an opposing second surface; a sensor connected to the first surface of the transparent substrate; and a casing, including interconnects to the sensor, and defining a cavity and at least one aperture to the cavity, wherein the transparent substrate and the sensor are located within the cavity with the second surface of the transparent substrate adjacent the at least one aperture.
1 . An apparatus comprising:
a transparent substrate comprising a first surface and an opposing second surface;
a sensor connected to the first surface of the transparent substrate; and
a casing, comprising interconnects to the sensor, and defining a cavity and at least one aperture to the cavity,
wherein the transparent substrate and the sensor are located within the cavity with the second surface of the transparent substrate adjacent the at least one aperture.
2 . An apparatus as claimed in claim 1 , wherein the sensor has a central active area adjacent the transparent substrate and a surrounding peripheral non-active area adjacent the transparent substrate and wherein a plurality of electrical components are mounted on the casing overlying the non-active area but not overlying the active area.
3 . An apparatus as claimed in claim 1 , wherein the transparent substrate is rigid.
4 . An apparatus as claimed in claim 1 , wherein the transparent substrate is configured to protect the sensor from thermal shock.
5 . An apparatus as claimed in claim 1 , wherein the transparent substrate is resistant to the processes used to remove a part of the casing to form the aperture.
6 . An apparatus as claimed in claim 1 , wherein the transparent substrate has an infrared filter coating or anti-reflective coating.
7 . An apparatus as claimed in claim 1 , wherein the transparent substrate is a glass substrate.
8 . An apparatus as claimed in claim 1 , wherein the apparatus has a front face, a rear face and sidewalls, wherein the front face comprises the casing and a portion of the transparent substrate exposed through the aperture and wherein the side walls and rear face comprise the casing.
9 . An apparatus as claimed in claim 1 , wherein the aperture is formed by removing a portion of the casing while transparent substrate and sensor are in situ.
10 . An apparatus as claimed in claim 1 , wherein the casing is a printed wiring board casing comprising a support, conductive interconnects supported by the support and protective material overlying at least an exterior portion of the support and encapsulating the conductive interconnects and the casing further comprising vias through the protective material to the conductive interconnect.
11 . An apparatus as claimed in claim 1 , wherein the casing is formed from cured resin-impregnated fabric.
12 . An apparatus as claimed in claim 1 , wherein the combination of sensor on transparent substrate is a surface mountable component.
13 . An apparatus as claimed in claim 1 , wherein interconnects on the first surface of the transparent substrate interconnect the sensor to electrical contacts between the transparent substrate and electrical interconnects of the casing.
14 . An apparatus as claimed in claim 13 , wherein the electrical contacts are formed from solidified solder.
15 . An apparatus as claimed in claim 1 , wherein the cavity has a first depth and the sensor has a first surface and a second surface and wherein the first surface of the sensor is adjacent the transparent substrate and the second surface of the sensor is separated from an internal rear wall of the casing by a gap unoccupied by other components.
16 . An apparatus as claimed in claim 1 , wherein the apparatus is a low-profile apparatus having a depth less than 0.3 mm.
17 . An apparatus as claimed in claim 1 , wherein the apparatus further comprises an optical component that contacts the transparent substrate for support.
18 . An apparatus as claimed in claim 1 , wherein the apparatus is a chip-scale package wherein sensor is a chip.
19 . An apparatus as claimed in claim 1 , wherein the apparatus is a camera module.
20 . A method comprising:
encapsulating, at least partially, a transparent substrate supporting a sensor, in a casing comprising interconnects to the sensor.
21 . A method as claimed in claim 20 , wherein the sensor has a central active area and a surrounding peripheral non-active area, wherein the active area is positioned adjacent an aperture in the casing and wherein a plurality of electrical components are mounted on the casing overlying the non-active area but not overlying the active area.
22 . A method as claimed in claim 20 , wherein the transparent substrate is configured to protect the sensor from thermal shock during formation of the casing.
23 . A method as claimed in claim 20 , wherein an aperture in the casing to expose the transparent substrate and supported sensor is formed by removing a portion of the casing that overlies the transparent substrate, wherein the transparent substrate protects the sensor.
24 . A method as claimed in claim 23 , wherein the transparent substrate is resistant to the processes used to remove a part of the casing to form the aperture.
25 . A method as claimed in claim 20 , wherein the encapsulating casing is formed as a printed wiring board casing comprising a support, conductive interconnects supported by the support and protective material overlying at least an exterior portion of the support, the method further comprising forming vias through the protective material to at least some of the conductive interconnects.
26 . A method as claimed in claim 20 , comprising forming the casing by curing resin-impregnated fabric.
27 . A method as claimed in claim 20 , comprising surface mounting the transparent substrate supporting the sensor.
28 . A method as claimed in claim 20 , comprising surface mounting the transparent substrate supporting the sensor, by creating solder contacts between interconnects on the first surface of the transparent substrate that interconnect the sensor and electrical interconnects of the casing.