Circuit board assembly with flexible printed circuit board and reinforcing plate
A circuit board assembly includes a flexible circuit board, a dielectric layer and a reinforcing plate. The flexible circuit board includes a surface. A copper plating layer is positioned on the surface. The copper plating layer includes a circuit portion and a grounding portion. The circuit portion is entirely covered by the dielectric layer. The grounding portion is exposed outside the dielectric layer. The dielectric layer includes a bonding portion. The reinforcing plate includes a connection surface. The connection surface defines a cavity spatially corresponding to the bonding portion. The connection surface also includes an extending portion which is bulgy with respect to a bottom surface of the cavity. The extending portion spatially corresponds to the grounding portion. The bonding portion is received in the cavity with the extending portion in contact with and electrically connecting to the grounding portion by means of a conductive adhesive.
1. A circuit board assembly comprising:
a flexible circuit board comprising a first surface;
a copper plating layer positioned on the first surface, the copper plating layer comprising a circuit portion and a grounding portion;
a dielectric layer, the circuit portion entirely covered by the dielectric layer, the grounding portion exposed outside the dielectric layer, the dielectric layer comprising a bonding portion, the grounding portion surrounding the bonding portion;
a conductive adhesive; and
a reinforcing plate comprising a connection surface connected to the bonding portion, the connection surface defining a cavity spatially corresponding to the bonding portion, the connection surface also comprising an extending portion which is bulgy with respect to a bottom surface of the cavity, the extending portion spatially corresponding to the grounding portion, the bonding portion received in the cavity with the extending portion in contact with and electrically connecting to the grounding portion by means of the conductive adhesive.
2. The circuit board assembly of claim 1 , wherein the shape of the extending portion corresponds to the shape of the grounding portion.
3. The circuit board assembly of claim 2 , wherein the grounding portion is “U” shaped.
4. The circuit board assembly of claim 1 , wherein the reinforcing plate is made of metal.
5. The circuit board assembly of claim 1 , wherein the dielectric layer is made of resin, and comprises a non-bonded portion connecting to the bonding portion.
6. The circuit board assembly of claim 1 , wherein the conductive adhesive coats a bottom surface of the cavity.
7. The circuit board assembly of claim 1 , wherein the shape and size of the cavity of the reinforcing plate respectively correspond to the shape and size of the bonding portion.
8. The circuit board assembly of claim 1 , wherein the size of the bonding portion is smaller than the size of bottom surface of the cavity.
9. The circuit board assembly of claim 1 , wherein the conductive adhesive is an anisotropic conductive film.
10. The circuit board assembly of claim 1 , wherein the shape of the reinforcing plate corresponds to the shape of the bonding portion.
11. The circuit board assembly of claim 10 , wherein both the bonding portion and the reinforcing plate are substantially rectangular in shape.