IP Library Granted Patent US 9,151,799
Granted Patent B2
US 9,151,799 · App. 13/707,966 · Granted Oct 6, 2015

Fine pitch interface for probe card

Inventor: Ka Ng Chui (Menlo Park, CA)
Assignee: Corad Technology Inc.
G01R31/2889G01R1/07364
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Quick Facts
Patent No.
US 9,151,799
App. No.
13/707,966
Granted
Oct 6, 2015
Kind
B2
Abstract

A probe card interface for interfacing a probe head with a first circuit. The probe card interface includes an impedance control element to interface a first set of pins of the probe head with the first circuit. The impedance control element is further configured to control the impedance of the first set of pins. The probe card interface includes a conductive plane to interface a second set of pins of the probe head with the first circuit. The conductive plane is further coupled to provide at least one of power or ground to the second set of pins.

Claims (11)

1. A probe card interface comprising:

an impedance control element to connect a first set of pins of a probe head with a first circuit, wherein the impedance control element is configured to control the impedance of the first set of pins, and wherein the impedance control element includes a dielectric substrate;

a conductive plane to connect a second set of pins of the probe head with the first circuit, wherein the conductive plane is coupled to at least one of a power source or ground, and includes a metal layer and a layer of conductive adhesive material;

a first set of conductors embedded, at least in part, within the dielectric substrate to connect the first set of pins to the first circuit; and

a second set of conductors embedded, at least in part, within the dielectric substrate and within the conductive adhesive material to provide at least one of power or ground to the second set of pins.

2. The probe card interface of claim 1 , wherein the dielectric substrate is coupled between two ground planes.

3. The probe card interface of claim 2 , wherein one or more of the pins of the first set of pins comprises a conductive wire.

4. The probe card interface of claim 1 , wherein the conductive plane is coupled to ground.

5. The probe card interface of claim 4 , wherein the second set of pins includes at least a power pin and a ground pin.

6. The probe card interface of claim 5 , wherein the ground pin is coupled to the conductive plane via a conductive wire of the second set of conductors.

7. The probe card interface of claim 6 , wherein the power pin is coupled to a power source on the first circuit via a shielded wire of the second set of conductors.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2023
From: ZEROONETEST TECHNOLOGY INC.
To: ZERO ONE SEMICONDUCTOR TECHNOLOGY (CHANGZHOU) CO., LTD.
Reel/Frame 063941/0248 →
CHANGE OF NAME Recorded Jan 20, 2022
From: CORAD TECHNOLOGY INC.
To: ZERO ONE TECHNOLOGY, INC.
Reel/Frame 059579/0249 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2022
From: ZERO ONE TECHNOLOGY, INC.
To: ZEROONETEST TECHNOLOGY INC.
Reel/Frame 058714/0315 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 10, 2012
From: CHUI, KA NG
To: CORAD TECHNOLOGY INC.
Reel/Frame 029439/0548 →
Continuity (2)
Continuation In Part 13644162 · Oct 3, 2012
Related Publication 20140091825A1 · Apr 3, 2014