Package for an implantable device
The present invention is an implantable electronic device formed within a biocompatible hermetic package. Preferably the implantable electronic device is used for a visual prosthesis for the restoration of sight in patients with lost or degraded visual function. The package is formed from a thin film of hermetic biocompatible material to minimize the size of the implanted device.
1. An implantable device, comprising:
an electrically non-conductive substrate having and interior surface, and an exterior surface on an opposite of said electrically non-conductive substrate from the interior surface;
a plurality of electrically conductive feedthroughs through the electrically non-conductive substrate and substantially flush with the exterior surface of the electrically non-conductive substrate;
a circuit attached to the interior surface of the electrically non-conductive substrate; and
a cover bonded to the electrically non-conductive substrate, the cover, the electrically non-conductive substrate and the electrically conductive feedthroughs forming a hermetic package.
2. The implantable device according to claim 1 , wherein the cover is metal and the electrically non-conductive base is ceramic and further comprising a braze joint between the cover and the electrically non-conductive substrate.
3. The implantable device according to claim 1 , further comprising electrodes suitable to stimulate neural tissue and electrically coupled to the feedthroughs.
4. The implantable device according to claim 3 , wherein the electrodes are suitable to stimulate visual neurons to create artificial vision.
5. The implantable device according to claim 4 , wherein the electrodes are bonded to the feedthroughs by insulated conductors.
6. The implantable device according to claim 1 , wherein the feedthroughs are straight feedthroughs.
7. The implantable device according to claim 1 , wherein the electronics unit is a flip-chip bonded to the interior surface of the electrically non-conductive base.
8. The implantable device according to claim 1 , wherein the electrically non-conductive base comprises ceramic.
9. The implantable device according to claim 8 , wherein the ceramic comprises aluminum oxide.
10. The implantable device according to claim 1 , wherein the cover contains metal.
11. The implantable device according to claim 1 , wherein the cover comprises a ring and a lid.
12. The implantable device according to claim 1 , wherein electrodes are electroplated on the feedthroughs.
13. The implantable device according to claim 2 , wherein the braze joint comprises titanium.
14. The implantable device according to claim 2 , wherein the braze joint comprises nickel.
15. The implantable device according to claim 1 , wherein the braze joint comprises gold.
16. The implantable device according to claim 1 , wherein said feedthroughs are straight through the electrically non-conductive substrate.