Microelectronic packages with dual or multiple-etched flip-chip connectors
View Patent ↗A packaged microelectronic element includes a microelectronic element having a front surface and a plurality of first solid metal posts extending away from the front surface. A substrate has a major surface and a plurality of conductive elements exposed at the major surface and joined to the first solid metal posts. In particular examples, the conductive elements can be bond pads or can be second posts having top surfaces and edge surfaces extending at substantial angles away therefrom. Each first solid metal post includes a base region adjacent the microelectronic element and a tip region remote from the microelectronic element, the base region and tip region having respective concave circumferential surfaces. Each first solid metal post has a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region.
1. A packaged microelectronic element, comprising:
a microelectronic element having a front surface and a plurality of solid metal posts extending away from the front surface; and
a substrate having a major surface and a plurality of conductive elements exposed at the major surface, the conductive elements being joined to the solid metal posts;
each solid metal post including a base region adjacent the microelectronic element and a tip region, remote from the microelectronic element, the base region and tip region having respective concave circumferential surfaces;
each solid metal post having a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region,
wherein, within each of the solid metal posts, the base region and the tip region are formed as a unitary body of metal.
2. The packaged microelectronic element of claim 1 , wherein the solid metal posts are joined to the conductive elements with solder, the solder covers at least portions of edge surfaces of each solid metal post, and the solder does not touch the base region of any of the solid metal posts.
3. The packaged microelectronic element of claim 2 , wherein the solder does not touch the front surface of the microelectronic element.
4. The packaged microelectronic element of claim 1 , wherein the solid metal posts are joined to the conductive elements with solder, and wherein the solder touches only a top surface of each solid metal post.
5. The packaged microelectronic element of claim 1 , wherein the solid metal posts are arranged in an array having a plurality of rows of solid metal posts and a plurality of columns of solid metal posts, and each solid metal post is generally in the form of a body of revolution about a central axis.
6. The packaged microelectronic element of claim 1 , wherein the horizontal dimension of each solid metal post in the base region defines a minimum width at a base of the respective solid metal post adjacent the front surface of the microelectronic element.
7. The packaged microelectronic element of claim 1 , wherein the solid metal posts are first solid metal posts and the conductive elements include a plurality of second solid metal posts extending above the major surface and joined to the first solid metal posts, the second posts having top surfaces remote from the major surface of the substrate and edge surfaces extending at substantial angles away from the top surfaces.
8. The packaged microelectronic element of claim 7 , wherein each second solid metal post includes a base region adjacent the substrate and a tip region, remote from the substrate, each second solid metal post having a horizontal dimension which is a third function of vertical location in the base region and which is a fourth function of vertical location in the tip region.
9. A packaged microelectronic element, comprising:
a microelectronic element having a front surface and a plurality of solid metal posts extending away from the front surface; and
a substrate having a major surface and a plurality of conductive elements exposed at the major surface, the conductive elements being joined to the solid metal posts;
each solid metal post including a base region adjacent the microelectronic element and a tip region, remote from the microelectronic element, the base region and tip region having respective concave circumferential surfaces,
each solid metal post having a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region,
wherein the solid metal posts are arranged in an array having a plurality of rows of solid metal posts and a plurality of columns of solid metal posts, and each solid metal post is generally in the form of a body of revolution about a central axis.
10. The packaged microelectronic element of claim 9 , wherein the solid metal posts are joined to the conductive elements with solder, the solder covers at least portions of edge surfaces of each solid metal post, and the solder does not touch the base region of any of the solid metal posts.
11. The packaged microelectronic element of claim 9 , wherein the solid metal posts are first solid metal posts and the conductive elements include a plurality of second solid metal posts extending above the major surface and joined to the first solid metal posts, the second posts having top surfaces remote from the major surface of the substrate and edge surfaces extending at substantial angles away from the top surfaces.
12. The packaged microelectronic element of claim 11 , wherein each second solid metal post includes a base region adjacent the substrate and a tip region, remote from the substrate, the base region and tip region of each second solid metal post having respective concave circumferential surfaces.
13. A packaged microelectronic element, comprising:
a microelectronic element having a front surface and a plurality of first solid metal posts projecting above the front surface, the first posts having top surfaces remote from the front surface and edge surfaces extending at substantial angles away from the front surface; and
a substrate having a major surface and a plurality of second solid metal posts extending from the major surface and joined to the first solid metal posts;
each second solid metal post including a base region adjacent the major surface of the substrate and a tip region, remote from the major surface, the base region and tip region having respective concave circumferential surfaces;
each second solid metal post having a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region,
wherein, within each of the second solid metal posts, the base region and the tip region are formed as a unitary body of metal.
14. The packaged microelectronic element of claim 13 , wherein the first solid metal posts are joined to the second solid metal posts with solder, the solder covers at least portions of edge surfaces of each solid metal post, and the solder does not touch the base region of any of the solid metal posts.
15. The packaged microelectronic element of claim 13 , wherein the second solid metal posts are arranged in an array having a plurality of rows of second solid metal posts and a plurality of columns of second solid metal posts, and each second solid metal post is generally in the form of a body of revolution about a central axis.
16. A method of assembling a packaged microelectronic element comprising:
(a) providing a microelectronic element having a front surface and a plurality of solid metal posts projecting in a vertical direction above the front surface, each solid metal post including a base region adjacent the front surface and a tip region, remote from the front surface, the base region and the tip region having respective concave circumferential surfaces, each solid metal post having a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region;
(b) at least substantially aligning the plurality of solid metal posts with a plurality of conductive elements exposed at a major surface of a substrate; and
(c) joining the solid metal posts of the microelectronic element with the conductive elements of the substrate,
wherein the solid metal posts are first solid metal posts and the conductive elements include a plurality of second solid metal posts extending above the major surface and joined to the first solid metal posts, the second posts having top surfaces remote from the major surface of the substrate and edge surfaces extending at substantial angles away from the top surfaces, and wherein the joining step is performed so that the tips of the first solid metal posts are joined with the top surfaces of corresponding ones of the second solid metal posts.
17. The method of claim 16 , wherein step (c) includes heating solder to a melting temperature, wherein the solder flows onto exposed portions of edge surfaces of the first and second solid metal posts, and wherein the solder does not flow onto the base region of any of the first and second solid metal posts.