Inductor formed in substrate
View Patent ↗A method and device includes a first conductor formed on a first dielectric layer as a partial turn of a coil. A second conductor is formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil. A vertical interconnect couples the first and second conductors to form a first full turn of the coil. The interconnect coupling can be enhanced by embedding some selective magnetic materials into the substrate.
1. A device comprising:
a first conductor formed on a first dielectric layer as a partial turn of a coil;
a second conductor formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil;
a vertical interconnect coupling the first and second conductors to form a first full turn of the coil;
an ultra-thin core supporting the dielectric layers and conductors on a first side of the ultra-thin core;
a single magnetic core disposed within the first full turn of the coil, wherein the magnetic core includes magnetic material dispersed in an epoxy resin, wherein the magnetic domains are aligned; and
a fine line formation on the first dielectric layer using fine solder balls to couple to a die.
2. The device of claim 1 and further comprising two additional partial turn conductors on additional dielectric layers coupled to form a second full turn of the coil.
3. The device of claim 2 wherein the magnetic core comprises high magnetic permittivity material particles dispersed in epoxy resin.
4. The device of claim 1 wherein the conductors comprise copper traces.
5. The device of claim 1 wherein the vertical interconnect comprises copper.
6. The device of claim 1 wherein a second set of dielectric layers symmetric in number and thickness are supported on a second side of the ultra-thin core.
7. The device of claim 6 and further comprising a core supporting the symmetric set of dielectric layers on a first side, and a second symmetric set of dielectric layers and conductors on a second side of the core.
8. The device of claim 6 and further comprising a conductive vertical interconnect through multiple dielectric layers through the ultra-thin core.
9. A device comprising:
a first copper conductor formed on a first dielectric layer as a partial turn of a coil;
a second copper conductor formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil;
a copper vertical interconnect coupling the first and second conductors to form a first full turn of the coil;
an ultra-thin core supporting the dielectric layers and conductors on a first side of the ultra-thin core;
a single magnetic core disposed within first full turn of the coil, wherein the magnetic core includes magnetic material dispersed in an epoxy resin, wherein the magnetic domains are aligned; and
a fine line formation on the first dielectric layer using fine solder balls to couple to a die.
10. The device of claim 9 and further comprising two additional partial turn conductors on additional dielectric layers coupled to form a second full turn of the coil.
11. The device of claim 10 wherein the magnetic core comprises high magnetic permittivity material particles dispersed in epoxy resin.