Process for removing material from substrates
View Patent ↗A method of removing materials, and preferably photoresist, from a substrate comprises dispensing a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors and having a water/sulfuric acid molar ratio of no greater than 5:1 onto an material coated substrate in an amount effective to substantially uniformly coat the material coated substrate. The substrate is preferably heated to a temperature of at least about 90° C., either before, during or after dispensing of the liquid sulfuric acid composition. After the substrate is at a temperature of at least about 90° C., the liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. The substrate is then preferably rinsed to remove the material.
1. A method for treatment of a semiconductor substrate by varying direction of a spray of a liquid from a three orifice nozzle, comprising the steps of
a) providing a nozzle having
i) a first orifice provided with liquid from a liquid source under sufficient pressure to eject a stream of liquid therefrom;
ii) a first gas orifice provided with a gas from a first gas source, the gas being provided at a regulated pressure to eject a stream of gas from the first gas orifice to at least partially deflect the stream of liquid;
iii) a second gas orifice provided with a second gas from a second gas source, the gas being provided at a regulated pressure to eject a stream of gas from the second gas orifice to at least partially deflect the stream of liquid; and
b) changing the spray direction of liquid from the nozzle during a treatment process by modulating the pressure of the gas from the first gas orifice and the second gas orifice without moving the nozzle, thereby dispensing the liquid onto the semiconductor substrate.
2. The method of claim 1 , where the spray direction of liquid from the nozzle is changed in a sweeping motion.
3. The method of claim 1 , wherein the spray of a liquid is carried out in a wafer treatment process.