Patent Assignment
Reel/Frame 053366/0139
Conversion
Recorded: 2020-07-30
Pages: 5
Assignor
TEL FSI, INC.
Executed: 2019-12-31
Assignee
TEL MANUFACTURING AND ENGINEERING OF AMERICA, INC.
3455 LYMAN BLVD., CHASKA, MINNESOTA, 55318
Covered Properties
(64)
Nozzle Design for Generating Fluid Streams Useful in the Manufacture of Microelectronic Devices
Semiconductor Wafer Cleaning Systems and Methods
Thermal Process Station with Heated Lid
Rotary Unions, Fluid Delivery Systems, and Related Methods
System and Method for Carrying Out Liquid and Subsequent Drying Treatments on One or More Wafers
Methods for Rinsing Microelectronic Substrates Utilizing Cool Rinse Fluid Within a Gas Enviroment Including a Drying Enhancement Substance
Reagent Activator for Electroless Plating
Barrier Structure and Nozzle Device for Use in Tools Used to Process Microelectronic Workpieces with One or More Treatment Fluids
Process for Removing Material from Substrates
Barrier Structure and Nozzle Device for Use in Tools Used to Process Microelectronic Workpieces with One or More Treatment Fluids
Process for Treatment of Substrates with Water Vapor or Steam
Barrier Structure and Nozzle Device for Use in Tools Used to Process Microelectronic Workpieces with One or More Treatment Fluids
Rinsing Methodologies for Barrier Plate and Venturi Containment Systems in Tools Used to Process Microelectronic Workpieces with One or More Treatment Fluids, and Related Apparatuses
Reagent Activator for Electroless Plating
Substrate Processing Systems and Related Methods
Tools and Methods for Processing Microelectronic Workpieces Using Process Chamber Designs That Easily Transition Between Open and Closed Modes of Operation
Process for Treatment of Semiconductor Wafer Using Water Vapor Containing Environment
Apparatus for Removing Material from One or More Substrates
Process for Treatment of Substrates with Water Vapor or Steam
Wet Processing of Microelectronic Substrates with Controlled Mixing of Fluids Proximal to Substrate Surfaces
Application:
13/083,948 →
Publication:
US 2011/0259376
Methodologies for Rinsing Tool Surfaces in Tools Used to Process Microelectronic Workpieces
Barrier Structure and Nozzle Device for Use in Tools Used to Process Microelectronic Workpieces with One or More Treatment Fluids
Process for Selectively Removing Nitride from Substrates
Acid Treatment Strategies Useful to Fabricate Microelectronic Devices and Precursors Thereof
Tools and Methods for Processing Microelectronic Workpieces Using Process Chamber Designs That Easily Transition Between Open and Closed Modes of Operation
Method of Removing Liquid from a Barrier Structure
Method and Apparatus for Treating a Workpiece with Arrays of Nozzles
Barrier Structure and Nozzle Device for Use in Tools Used to Process Microelectronic Workpieces with One or More Treatment Fluids
Process for Removing Material from Substrates
Process for Silicon Nitride Removal Selective to SiGex
Process for Removing Carbon Material from Substrates
Tools and Methods for Processing Microelectronic Workpieces Using Process Chamber Designs That Easily Transition Between Open and Closed Modes of Operation
Apparatus and Method for Scanning an Object Through a Fluid Spray
Process for Increasing the Hydrophilicity of Silicon Surfaces Following Hf Treatment
Processing System and Method for Providing a Heated Etching Solution
Processing System and Method for Providing a Heated Etching Solution
Process Comprising Water Vapor for Haze Elimination and Residue Removal
Application:
14/255,570 →
Publication:
US 2014/0332034
Method of Using Separate Wafer Contacts During Wafer Processing
Method of Substrate Temperature Control During High Temperature Wet Processing
Detection of Lost Wafer from Spinning Chuck
Method and Apparatus for Treating a Workpiece with Arrays of Nozzles
Systems & Methods for Metering a Dose Volume of Fluid used to Treat Microelectronic Substrates
Process for Silicon Nitride Removal Selective to SiGex
Systems and Methods for Treating Substrates with Cryogenic Fluid Mixtures
Systems and Methods for Treating Substrates with Cryogenic Fluid Mixtures
Systems and Methods for Treating Substrates with Cryogenic Fluid Mixtures
Systems and Methods for Treating Substrates with Cryogenic Fluid Mixtures
Methodologies for Rinsing Tool Surfaces in Tools Used to Process Microelectronic Workpieces
Apparatus and Method for Scanning an Object Through a Fluid Stream
Systems and Methods for Treating Substrates with Cryogenic Fluid Mixtures
Apparatus for Spraying Cryogenic Fluids
Systems and Methods for Treating Substrates with Cryogenic Fluid Mixtures
Application:
15/721,396 →
Publication:
US 2018/0025904
Magnetically Levitated and Rotated Chuck for Processing Microelectronic Substrates in a Process Chamber
Translating and Rotating Chuck for Processing Microelectronic Substrates in a Process Chamber
Wafer Edge Lift Pin Design for Manufacturing a Semiconductor Device
Systems and Methods for Rotating and Translating a Substrate in a Process Chamber
System and Method for Monitoring Treatment of Microelectronic Substrates with Fluid Sprays Such as Cryogenic Fluid Sprays
Systems and Methods for Treating Substrates with Cryogenic Fluid Mixtures
Microelectronic Treatment System Having Treatment Spray with Controllable Beam Size
Pressure Control Strategies to Provide Uniform Treatment Streams in the Manufacture of Microelectronic Devices
System and Method for Monitoring Treatment of Microelectronic Substrates with Fluid Sprays Such as Cryogenic Fluid Sprays
Magnetic Integrated Lift Pin System for a Chemical Processing Chamber
Treatment Systems with Repositionable Nozzle Useful in the Manufacture of Microelectronic Devices
Method for Achieving Stiction-Free High-Aspect-Ratio Microstructures After Wet Chemical Processing
Application:
16/678,667 →
Publication:
US 2020/0148534
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 17, 2001
From: KUNKEL, PAM; NARAYANSWAMI, NATRAJ; PATRIN, JOHN C.
To: FSI INTERNATIONAL, INC.
Reel/Frame 012173/0573 →
Assignment of Assignor's Interest
Dec 9, 2002
From: CHRISTENSON, KURT K.; RATHMAN, CHRISTINA A.
To: FSI INTERNATIONAL, INC.
Reel/Frame 013560/0444 →
Assignment of Assignor's Interest
Aug 4, 2003
From: NGUYEN, VUONG P.; SIMS, RICHARD E.; ZHU, XIAOGUANG
To: FSI INTERNATIONAL, INC.
Reel/Frame 015059/0875 →
Assignment of Assignor's Interest
Mar 12, 2004
From: BENSON, ARNE C.; HANZLIK, EDWARD D.
To: FSI INTERNATIONAL, INC.
Reel/Frame 015095/0120 →
Assignment of Assignor's Interest
Oct 4, 2004
From: BENSON, ARNE C.; OLSON, ERIK D.; SPAETH, DOUGLAS S.
To: FSI INTERNATIONAL, INC.
Reel/Frame 015847/0336 →
Assignment of Assignor's Interest
Apr 1, 2005
From: GAST, TRACEY A.
To: FSI INTERNATIONAL, INC.
Reel/Frame 016440/0307 →
Assignment of Assignor's Interest
Dec 13, 2005
From: CHRISTENSON, KURT KARL
To: FSI INTERNATIONAL, INC.
Reel/Frame 017447/0872 →
Corrective Assignment to Correct the Assignees Address Previously Recorded on Reel 017447 Frame 0872
Apr 17, 2006
From: CHRISTENSON, KURT KARL
To: FSI INTERNATIONAL, INC.
Reel/Frame 017791/0092 →
Assignment of Assignor's Interest
Mar 16, 2007
From: CHRISTENSON, KURT KARL; HANESTAD, RONALD J.; WAGENER, THOMAS J.; RUETHER, PATRICIA ANN
To: FSI INTERNATIONAL, INC.
Reel/Frame 019057/0798 →
Assignment of Assignor's Interest
Sep 6, 2007
From: COLLINS, JIMMY D.; DEKRAKER, DAVID; GAST, TRACY A.; ROSE, ALAN D.
To: FSI INTERNATIONAL, INC.
Reel/Frame 019806/0804 →
Assignment of Assignor's Interest
Jul 11, 2008
From: DEKRAKER, DAVID; BUTTERBAUGH, JEFFERY W.; WILLIAMSON, RICHARD E.
To: FSI INTERNATIONAL, INC.
Reel/Frame 021259/0371 →
Assignment of Assignor's Interest
Oct 21, 2008
From: DEKRAKER, DAVID; COLLINS, JIMMY D.; GAST, TRACY A.; ROSE, ALAN D.
To: FSI INTERNATIONAL, INC.
Reel/Frame 021725/0340 →
Assignment of Assignor's Interest
May 6, 2009
From: CHRISTENSON, KURT K.; DEKRAKER, DAVID
To: FSI INTERNATIONAL, INC.
Reel/Frame 022647/0677 →
Assignment of Assignor's Interest
Jul 13, 2009
From: LAUERHAAS, JEFFREY M.; COLLINS, JIMMY D.; GAST, TRACY A.; ROSE, ALAN D.
To: FSI INTERNATIONAL, INC.
Reel/Frame 022953/0014 →
Assignment of Assignor's Interest
Jul 24, 2009
From: CHRISTENSON, KURT K.
To: FSI INTERNATIONAL, INC.
Reel/Frame 023009/0772 →
Assignment of Assignor's Interest
Dec 20, 2011
From: CHRISTENSON, KURT KARL
To: FSI INTERNATIONAL, INC.
Reel/Frame 027420/0696 →
Merger, Change of Name
Jan 11, 2013
From: FSI INTERNATIONAL, INC.; RB MERGER CORPORATION
To: TEL FSI, INC.
Reel/Frame 029618/0179 →
Assignment of Assignor's Interest
Aug 20, 2013
From: COLLINS, JIMMY D.; COOPER, SAMUEL A.; EPPES, JAMES M.; ROSE, ALAN D.
To: FSI INTERNATIONAL, INC.
Reel/Frame 031045/0846 →
Assignment via Employment Agreement
Aug 20, 2013
From: MEKIAS, KADER
To: FSI INTERNATIONAL, INC.
Reel/Frame 031049/0952 →
Merger, Change of Name
Jan 2, 2014
From: FSI INTERNATIONAL, INC.; RB MERGER CORPORATION
To: TEL FSI, INC.
Reel/Frame 031910/0689 →
Assignment via Employment Agreement
Jan 7, 2014
From: MEKIAS, KADER
To: FSI INTERNATIONAL, INC.
Reel/Frame 031935/0157 →
Assignment of Assignor's Interest
Jan 7, 2014
From: COLLINS, JIMMY D.; COOPER, SAMUEL A.; EPPES, JAMES M.; ROSE, ALAN D.
To: FSI INTERNATIONAL, INC.
Reel/Frame 031908/0878 →