Method of removing liquid from a barrier structure
View Patent ↗The present invention provides methods of removing liquid from a barrier structure in the context of treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like.
1. A method of treating a microelectronic workpiece, comprising the steps of:
a) positioning the workpiece in a processing chamber of an apparatus;
b) causing a barrier structure to overly the workpiece, said barrier structure including a lower surface overlying and at least partially covering the workpiece to provide a covered workpiece during the treatment;
c) subjecting the covered workpiece to a treatment that comprises introducing a liquid into the process chamber; and
d) applying a vacuum to an aspirating pathway having at least one fluid inlet proximal to and in fluid communication with the lower surface of the barrier structure to aspiratingly remove liquid that collects on the lower surface of the barrier structure,
wherein the distance between the lower surface of the barrier structure and the workpiece tapers in a direction towards the outer periphery of the barrier structure so that liquid on the lower surface of the barrier structure can flow and be in fluid communication with the aspirating pathway.
2. The method of claim 1 , wherein aspiratingly removing a portion of the liquid comprises aspiratingly removing a portion of the liquid through the barrier structure.
3. The method of claim 1 , wherein the at least one fluid inlet is located on an outer edge of the barrier structure.
4. The method of claim 1 , wherein the at least one fluid inlet is located on a component that is separate from the barrier structure, wherein the separate component is in fluid communication with the lower surface of the barrier structure.
5. The method of claim 1 , wherein the aspirating pathway comprises a plurality of inlet ports located on the lower surface of the barrier structure.
6. The method of claim 1 , wherein the aspirating pathway includes aspirating channels, wherein each aspirating channel extends between an inlet port located on the lower surface of the barrier structure and an outlet port located on the top surface of the barrier structure.
7. The method of claim 6 , wherein the inlet ports are distributed around the outer periphery of the lower surface of the barrier structure.
8. The method of claim 7 , wherein the top surface of the barrier structure further comprises an annular trough extending around the outer periphery of the top surface of the barrier structure and the outlet ports are positioned in a manner so that liquid removed from the lower surface of the barrier structure through the aspirating channels exits the outlet port into the annular trough.
9. The method of claim 6 , wherein the lower surface of the barrier structure further comprises an annular rim extending from the lower surface of the barrier structure, wherein the annular rim is positioned on the lower surface of the barrier structure in a manner to help collect liquid on the lower surface so that the liquid can be aspiratingly removed via the aspirating channels.
10. A method of treating a microelectronic workpiece, comprising the steps of:
a) positioning the workpiece in a processing chamber of an apparatus;
b) causing a barrier structure to overly the workpiece, said barrier structure including a lower surface overlying and at least partially covering the workpiece during the treatment, wherein the barrier structure includes a feature positioned on the lower surface of the barrier structure in a manner effective to help attract or help contain a liquid that is present on the lower surface of the barrier structure;
c) subjecting the covered workpiece to a treatment that comprises introducing a liquid into the process chamber;
d) applying a vacuum to an aspirating pathway having at least one fluid inlet proximal to and in fluid communication with the feature to aspiratingly remove liquid that collects on the lower surface of the barrier structure.
11. The method of claim 10 , wherein the feature is selected from the group consisting of depressions, protuberances, and combinations thereof.
12. The method of claim 11 , wherein the lower surface of the barrier structure and the feature are hydrophilic.
13. The method of claim 12 , wherein the lower surface of the barrier structure is made from material comprising quartz.