IP Library Granted Patent US 8,684,015
Granted Patent B2
US 8,684,015 · App. 13/548,489 · Granted Apr 1, 2014

Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation

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Quick Facts
Patent No.
US 8,684,015
App. No.
13/548,489
Granted
Apr 1, 2014
Kind
B2
Abstract

Strategies for tool designs and their uses wherein the tools can operate in either closed or open modes of operation. The tools easily transition between open and closed modes on demand. According to one general strategy, environmentally controlled pathway(s) couple the ambient to one or more process chambers. Air amplification capabilities upstream from the process chamber(s) allow substantial flows of air to be introduced into the process chamber(s) on demand. Alternatively, the fluid pathways are easily closed, such as by simple valve actuation, to block egress to the ambient through these pathways. Alternative flows of nonambient fluids can then be introduced into the process chamber(s) via pathways that are at least partially in common with the pathways used for ambient air introduction. In other strategies, gap(s) between moveable components are sealed at least with flowing gas curtains rather than by relying only upon direct physical contact for sealing.

Claims (17)

1. A system for processing a microelectronic workpiece, comprising:

a process chamber housing the workpiece, said process chamber comprising a boundary that isolates the workpiece from ambient air, wherein a portion of the boundary comprises a curtain of a flowing gas;

a moveable cover overlying the workpiece and defining at least a portion of a boundary of the processing chamber, said cover comprising a first state in which the cover is in a first position during a treatment of the workpiece housed in the process chamber and a second state in which the cover is in a second position that permits egress to the chamber and said cover optionally comprising at least one inlet through which at least one treatment fluid is introduced into the process chamber;

at least one boundary member having an edge proximal to but spaced apart from the cover when the cover is in the first state such that a gap exists between the cover and the at least one boundary member during a workpiece treatment;

a curtain of a flowing gas forming a boundary for the gap to help isolate the process chamber from ambient air during at least a portion of a treatment while the cover is in the first state, wherein the curtain of flowing gas flows across and through the gap.

2. A system for processing a microelectronic workpiece, comprising:

a) a process chamber housing the workpiece, said workpiece having an outer periphery;

b) a moveable cover overlying the workpiece and having an outer periphery, said cover comprising at least one inlet through which at least one treatment fluid is introduced into the process chamber;

c) a moveable boundary defining at least a portion of an exhaust duct having an inlet proximal to the outer periphery of the workpiece, said moveable boundary having an inner periphery proximal to but spaced apart from the outer periphery of the cover during at least a portion of a treatment of the workpiece such that a gap exists between the cover and the moveable boundary; and

d) a curtain of flowing gas forming a boundary across the gap to help isolate the chamber from ambient air during at least a portion of the treatment, wherein the curtain of flowing gas flows across and through the gap.

3. The system of claim 2 , wherein the curtain of flowing gas and a physical seal between the moveable cover and the moveable boundary help to isolate the chamber from ambient air.

4. The system of claim 3 , further comprising a fluid pathway between the seal and the gap, said pathway comprising a plenum that helps to distribute the flow of the curtain of flowing gas to the gap.

5. The system of claim 4 , further comprising a fluid pathway between the seal and the gap, said pathway comprising a plenum that helps to distribute the flow of the curtain of flowing gas to the gap.

6. The system of claim 2 , wherein the curtain of flowing gas comprises an annular curtain of flowing gas.

7. The system of claim 2 , wherein the moveable cover comprises a barrier plate overlying the process chamber and an annular member attached to the barrier plate, the annular member overlying the moveable boundary and having a surface being spaced apart from the moveable boundary to define a plenum upstream from the gap.

8. The system of claim 7 , further comprising an annular seal ring between the barrier plate and the annular member wherein the annular seal ring seals an annular trough, said annular trough being coupled to a plurality of aspirating channels.

9. The system of claim 2 , wherein the moveable cover comprises a lower surface angled downward in a radially outward direction relative to an underlying plane of the workpiece.

Assignments (2)
CONVERSION Recorded Jul 30, 2020
From: TEL FSI, INC.
To: TEL MANUFACTURING AND ENGINEERING OF AMERICA, INC.
Reel/Frame 053366/0139 →
MERGER, CHANGE OF NAME Recorded Jan 11, 2013
From: FSI INTERNATIONAL, INC.; RB MERGER CORPORATION
To: TEL FSI, INC.
Reel/Frame 029618/0179 →