WET PROCESSING OF MICROELECTRONIC SUBSTRATES WITH CONTROLLED MIXING OF FLUIDS PROXIMAL TO SUBSTRATE SURFACES

1 . A method of processing a microelectronic workpiece, the method comprising:

positioning a microelectronic workpiece in a process chamber comprising first and second dispense nozzles the first and second dispense nozzles configured to independently direct one or more treatment fluids at the microelectronic workpiece;

dispensing a first treatment fluid into the process chamber with the first dispense nozzle;

terminating dispensing of the first treatment fluid into the process chamber with the first dispense nozzle;

applying suction to the first dispense nozzle; and

after applying suction to the first dispense nozzle, dispensing a second treatment fluid into the process chamber with the second dispense nozzle.

2 . The method of claim 1 , wherein the microelectronic workpiece comprises features having an aspect ratio of at least 5:1.

3 . The method of claim 1 , wherein the first dispense nozzle comprises a plurality of orifices.

4 . The method of claim 3 , comprising dispensing the first treatment to a central region of the microelectronic workpiece.

5 . The method of claim 3 , wherein the first dispense nozzle is positioned above the microelectronic workpiece and extends across at least a portion of a chord of the microelectronic workpiece.

6 . The method of claim 1 , comprising maintaining suction applied to the first dispense nozzle during at least a portion of dispensing the second treatment fluid from the second dispense nozzle.

7 . The method of claim 1 , comprising maintaining suction applied to the first dispense nozzle at least until dispensing the second treatment fluid from the second dispense nozzle is terminated.

8 . The method of claim 1 , comprising, after applying suction to the first dispense nozzle, dispensing a third treatment fluid with a third dispense nozzle.

9 . The method of claim 8 , wherein the third treatment fluid comprises water.

10 . The method of claim 1 , wherein the first and second treatment fluids mix exothermically.

11 . The method of claim 1 , wherein the first treatment fluid comprises an acid and the second treatment fluid comprises a fluid that exothermically mixes with the acid.

12 . The method of claim 1 , wherein the second treatment fluid comprises water and the first treatment fluid comprises a fluid that exothermically mixes with the water.

13 . The method of claim 1 , wherein the first treatment fluid comprises an acid and the second treatment fluid comprises water.

14 . The method of claim 13 , wherein the acid comprises an aqueous acid.

15 . The method of claim 1 , wherein either or both of the first and second treatment fluids comprise one or more concentrated or diluted acid.

16 . The method of claim 15 , wherein the acid comprises any of sulfuric acid, phosphoric acid, hydrochloric acid, and combinations thereof.

17 - 23 . (canceled)

24 . The method of claim 1 , comprising dispensing a fluid comprising sulfuric acid and optionally hydrogen peroxide at a temperature at the time of dispensing greater than about 30° C. with the first dispense nozzle, dispensing sulfuric acid at a temperature at the time of dispensing greater than about 30° C. with the first dispense nozzle, followed by terminating dispensing of sulfuric acid at a temperature at the time of dispensing greater than about 30° C. with the first dispense nozzle and subsequently applying suction to the first dispense nozzle, then dispensing water at a temperature less than about 30° C. with the second dispense nozzle.

25 . A method of processing a microelectronic workpiece, the method comprising:

positioning the microelectronic workpiece in a process chamber comprising first and second dispense orifices and the first and second dispense orifices configured to independently direct one or more treatment fluid at the microelectronic workpiece;

dispensing a first treatment fluid into the process chamber with the first dispense orifice;

applying suction to the first dispense orifice; and

after applying suction to the first dispense orifice, dispensing a second treatment fluid into the process chamber with the second dispense orifice.

26 . A method of processing a microelectronic workpiece, the method comprising:

positioning a microelectronic workpiece in a process chamber comprising a first nozzle comprising at least one orifice through which a first treatment fluid can be dispensed into the process chamber and a second nozzle distinct from the first nozzle and comprising at least one orifice through which a second treatment fluid can be dispensed into the process chamber; and

applying suction to one or both of the first and second nozzles thereby drawing the respective treatment fluid upstream from the one or both of the first and second nozzles.

27 . A method of processing a microelectronic device, the method comprising:

positioning a microelectronic workpiece in a process chamber comprising first and second dispense nozzles the first and second dispense nozzles configured to independently direct one or more treatment fluid at the microelectronic workpiece;

dispensing a first treatment fluid into the process chamber with the first dispense nozzle;

dispensing a second treatment fluid into the process chamber with the second dispense nozzle;

controlling the transition between a first chemical dispense and a second chemical dispense to avoid drips of one fluid from a first nozzle from falling onto a surface film of a second fluid being dispensed from a second nozzle; and

controlling the transition between dispensing the first treatment fluid and dispensing the second treatment fluid to avoid dripping of the first treatment fluid from the first nozzle from falling onto a surface film of the second treatment fluid on the microelectronic workpiece.