Methodologies for rinsing tool surfaces in tools used to process microelectronic workpieces
View Patent ↗Rinsing methodologies and components to accomplish rinsing of tool surfaces in tools that are used to process one or more microelectronic workpieces. The invention can be used to rinse structures that overlie a workpiece being treated in such a manner to function in part as a lid over the process chamber while also defining a tapering flow channel over the workpiece. Rather than spray rinsing liquid onto the surface in a manner that generates undue splashing, droplet, or mist generation, a swirling flow of rinse liquid is generated on a surface of at least one fluid passage upstream from the surface to be rinsed. The swirling flow then provides smooth, uniform wetting and sheeting action to accomplish rinsing with a significantly reduced risk of generating particle contamination.
1. An apparatus for processing at least one microelectronic workpiece, the apparatus comprising:
a) a process chamber in which the at least one microelectronic workpiece is positioned during processing;
b) a barrier structure including a lower surface, wherein the lower surface overlies and at least partially covers the at least one microelectronic workpiece during processing;
c) a passageway upstream from the process chamber, said passageway having a passageway wall fluidly coupled to the lower surface;
d) an annular reservoir upstream from the passageway, said annular reservoir receiving a rinsing liquid from a rinsing liquid supply;
e) an annular gap upstream from the passageway, said annular gap being fluidly coupled to the passageway wall; and
f) a plurality of obliquely aimed nozzles through which the rinsing liquid is obliquely jetted from the annular reservoir into the annular gap, said annular gap having a width such that a swirling, sheeting flow of the rinsing liquid is generated in the annular gap and then continues to swirl and sheet across the passageway wall without filling up the passageway when the rinsing liquid is ejected through the nozzles and into the annular gap and such that the passageway wall guides the swirling, sheeting flow of the rinsing liquid in a manner effective to cause the swirling, sheeting flow to form a sheeting flow of the rinsing liquid on the lower surface of the barrier structure.
2. The apparatus of claim 1 , wherein the barrier structure comprises an annular shape and wherein the lower surface of the barrier structure is angled downward in a radially outward direction from a central axis relative to the underlying workpiece.
3. The apparatus of claim 2 , wherein the nozzles comprise a plurality of grooves to obliquely aim the rinsing liquid through the nozzles.
4. The apparatus of claim 1 , wherein the nozzles comprise a plurality of nozzle groups, each group being obliquely aimed at the annular gap.
5. An apparatus for processing at least one microelectronic workpiece, the apparatus comprising:
a) a process chamber in which the at least one microelectronic workpiece is positioned during processing
b) a barrier structure including a lower surface that overlies and at least partially covers the at least one workpiece during processing;
c) at least one pathway providing an egress into the process chamber, the pathway including a pathway surface that is fluidly coupled to the lower surface of the barrier structure;
d) a generally annular gap positioned upstream from and fluidly coupled to the pathway surface; and
e) a plurality of flow channels collectively obliquely directed toward the generally annular gap, said annular gap having a width such that a swirling, sheeting flow of a rinsing liquid flows from the annular gap onto the pathway surface when the rinsing liquid is obliquely ejected from the flow channels and through the annular gap and such that the swirling, sheeting flow of the rinsing liquid is conveyed as a sheeting flow to the lower surface of the barrier structure via one or more surfaces comprising at least the pathway surface of the pathway.
6. The apparatus of claim 5 , wherein the pathway surface is fluidly coupled to the lower surface of the structure by one or more additional surfaces.
7. The apparatus of claim 6 , wherein the pathway surface is directly coupled to the lower surface.
8. The apparatus of claim 6 , wherein the pathway surface is indirectly coupled to the lower surface.
9. The apparatus of claim 5 , wherein the barrier structure comprises an annular shape and wherein the lower surface of the barrier structure is angled downward in a radially outward direction from a central axis relative to the underlying workpiece.