Process for treatment of semiconductor wafer using water vapor containing environment
View Patent ↗A process is provided for treating a semiconductor wafer at a target wafer temperature. This process includes the following steps: a) determining the target wafer temperature of the semiconductor wafer during a given wafer treatment process step; b) providing a treatment chamber having at least one semiconductor wafer disposed therein; c) dispensing water vapor into the treatment chamber in an amount to provide the chamber with an atmospheric environment having a dew point sufficiently close to the target wafer temperature to provide a temperature regulating effect; and d) initiating the given wafer treatment process step when the atmospheric environment of the treatment chamber is at the dew point of step c).
1. A process for treating a semiconductor wafer at a target wafer temperature, comprising
a) determining the target wafer temperature of the semiconductor wafer during a given wafer treatment process step;
b) providing a treatment chamber having at least one semiconductor wafer disposed therein;
c) dispensing water vapor into the treatment chamber in an amount to provide the chamber with an atmospheric environment having a dew point sufficiently, close to the target wafer temperature to provide a temperature regulating effect by allowing the temperature of the wafer to change by evaporation or condensation; and
d) initiating the given wafer treatment process step when the atmospheric environment of the treatment chamber is at the dew point of step c).
2. The process of claim 1 , wherein the dew point is within about 20° C. of the target wafer temperature.
3. The process of claim 1 , wherein the dew point is within about 10° C. of the target wafer temperature.
4. The process of claim 1 , wherein the dew point is within about 5° C. of the target wafer temperature.
5. The process of claim 1 , wherein the wafer treatment process step is initiated when the atmospheric environment of the treatment chamber is at the dew point at the target wafer temperature and when the wafer is at the target wafer temperature.
6. The process of claim 1 , wherein the at least one semiconductor wafer is at a temperature below the target wafer temperature prior to dispensing water vapor into the treatment chamber.
7. The process of claim 1 , wherein the atmospheric environment of the treatment chamber is at a temperature within the target wafer temperature.
8. The process of claim 1 , wherein the atmospheric environment of the treatment chamber is at a temperature that is higher than the target wafer temperature.
9. The process of claim 1 , wherein the dew point at the target wafer temperature is achieved by dispensing fully saturated water vapor into the treatment chamber until the dew point at the target wafer temperature within the treatment chamber is reached.
10. The process of claim 1 , wherein the water vapor is steam at a temperature of about 100° C.
11. The process of claim 1 , wherein the dew point at the target wafer temperature is achieved by dispensing less than fully saturated water vapor into the treatment chamber until the dew point at the target wafer temperature within the treatment chamber is reached.
12. The process of claim 11 , wherein the water vapor comprises nitrogen gas.
13. The process of claim 1 , wherein the at least one semiconductor wafer is at a temperature above the target wafer temperature prior to dispensing water vapor into the treatment chamber, the wafer comprising liquid aqueous composition on the wafer surface, and the wafer is allowed to cool to the desired target temperature.
14. A process for treating a semiconductor wafer at a target wafer temperature, comprising
a) determining the target wafer temperature of the semiconductor wafer during a given wafer treatment process step;
b) providing a treatment chamber having at least one semiconductor wafer disposed therein;
c) dispensing vapor into the treatment chamber in an amount to provide the chamber with an atmospheric environment having a dew point sufficiently close to the target wafer temperature to provide a temperature regulating effect by allowing the temperature of the wafer to change by evaporation or condensation; and
d) initiating the given wafer treatment process step when the atmospheric environment of the treatment chamber is at the dew point of step c).