Rinsing methodologies for barrier plate and venturi containment systems in tools used to process microelectronic workpieces with one or more treatment fluids, and related apparatuses
View Patent ↗Tool for treating microelectronic workpieces with one or more treatment materials, including liquids, gases, fluidized solids, dispersions, combinations of these, and the like. The invention provides an approach for rapid, efficient rinsing of wetted surface(s), and is particularly advantageous when used to rinse the lower surface of moveable barrier structures such as a barrier plate that overlies a workpiece being treated in such a manner to define a tapering flow channel over the workpiece. Rather than spray rinsing liquid onto the surface in a manner that generates undue splashing, droplet, or mist generation, the liquid is flowingly dispensed, preferably under laminar flow conditions, onto a surface that is in fluid communication with the surface to be rinsed. A smooth, uniform wetting and sheeting action results to accomplish rinsing with a significantly reduced risk of generating particle contamination.
1. An apparatus for processing at least one microelectronic workpiece, comprising:
a) a process chamber including a workpiece support that is positioned within the processing chamber and onto which the at least one microelectronic workpiece can be positioned during a treatment;
b) a barrier structure including a lower surface that overlies and at least partially covers a workpiece when provided for treatment, wherein the lower surface of the barrier structure includes a surface that angles toward the workpiece support in a radially outward direction;
c) an additional surface that is fluidly coupled to the barrier structure such that liquid can flow from the additional surface to the angled surface of the lower surface of the barrier structure; and
d) a plurality of nozzles aimed at and positioned sufficiently close to the additional surface so that a liquid can be flowingly dispensed onto said additional surface such that the liquid can form a sheet and wet the angled surface of the lower surface of the barrier structure.
2. The apparatus of claim 1 , wherein the plurality of nozzles comprise at least two nonparallel nozzles.
3. The apparatus of claim 2 , wherein said at least two nonparallel nozzles are nonplanar with respect to each other.
4. The apparatus of claim 2 , wherein said at least two nonparallel nozzles are planar with respect to each other.
5. The apparatus of claim 1 , wherein the nozzles are positioned sufficiently close to the additional surface such that the liquid can be dispensed onto said additional surface with substantially no splashing.
6. The apparatus of claim 1 , wherein the nozzles are positioned sufficiently close to the additional surface such that the liquid can be dispensed onto said additional surface under laminar flow conditions.
7. The apparatus of claim 1 , wherein the size of the nozzle orifices is variable.
8. The apparatus of claim 1 , wherein the spacing between adjacent nozzles is variable.
9. An apparatus for processing at least one microelectronic workpiece, comprising:
a) a process chamber including a workpiece support that is positioned within the processing chamber and onto which the at least one microelectronic workpiece can be positioned during a treatment;
b) a barrier structure including a lower surface that overlies and at least partially covers a workpiece when provided for treatment, wherein the lower surface of the barrier structure includes a surface that angles toward the workpiece support in a radially outward direction;
c) a venturi-shaped pathway providing an egress into the process chamber, said pathway including a pathway surface that is fluidly coupled to the barrier structure such that liquid can flow from the pathway surface to the angled surface of the lower surface of the barrier structure; and
d) at least one nozzle positioned in the pathway and aimed so that a liquid can be flowingly dispensed onto the pathway surface such that the liquid can form a sheet and wet the angled surface of the lower surface of the barrier structure.
10. The apparatus of claim 9 , wherein the venturi-shaped pathway has a throat region and the at least one nozzle is positioned upstream from the throat region so that the liquid can be dispensed onto the pathway surface and flow along the pathway surface through the throat region.