Resin composition, resist underlayer film, resist underlayer film-forming method and pattern-forming method
A resin composition for forming a resist underlayer film includes a resin that includes an aromatic ring, and a crosslinking agent having a partial structure represented by a following formula (i). X represents an oxygen atom, a sulfur atom, *—COO— or —NR A —. R 1 represents a hydrogen atom or a C 1-30 monovalent hydrocarbon group. R 2 represents a hydroxy group, a sulfanil group, a cyano group, a nitro group, a C 1-30 monovalent hydrocarbon group, a C 1-30 monovalent oxyhydrocarbon group or a C 1-30 monovalent sulfanilhydrocarbon group. p is an integer of 1 to 3.
1. A resin composition for forming a resist underlayer film, comprising:
a resin that comprises an aromatic ring; and
a crosslinking agent represented by formula (B-1):
wherein Me is a methyl group.
2. The resin composition according to claim 1 , wherein the resin is a novolak resin, a resol resin, an acenaphthylene resin, a styrene resin, a polyarylene resin, or a combination thereof.
3. The resin composition according to claim 1 , further comprising a solvent.
4. A resist underlayer film formed from the resin composition according to claim 1 .
5. A resist underlayer film-forming method comprising:
providing a coating film using the resin composition according to claim 1 ; and
heating the coating film.
6. A pattern-forming method comprising:
providing a resist underlayer film on an upper face side of a substrate using the resin composition according to claim 1 ;
providing a resist film on an upper face side of the resist underlayer film using a resist composition;
exposing the resist film;
developing the exposed resist film to form a resist pattern; and
sequentially dry etching the resist underlayer film and the substrate using the resist pattern as a mask.
7. A resin composition for forming a resist underlayer film, comprising:
a resin that comprises an aromatic ring; and
a crosslinking agent represented by formula (B-2):
wherein Et is an ethyl group.
8. The resin composition according to claim 7 , wherein the resin is a novolak resin, a resol resin, an acenaphthylene resin, a styrene resin, a polyarylene resin, or a combination thereof.
9. The resin composition according to claim 7 , further comprising a solvent.
10. A resist underlayer film formed from the resin composition according to claim 7 .
11. A resist underlayer film-forming method comprising:
providing a coating film using the resin composition according to claim 7 ; and
heating the coating film.
12. A pattern-forming method comprising:
providing a resist underlayer film on an upper face side of a substrate using the resin composition according to claim 9 ;
providing a resist film on an upper face side of the resist underlayer film using a resist composition;
exposing the resist film;
developing the exposed resist film to form a resist pattern; and
sequentially dry etching the resist underlayer film and the substrate using the resist pattern as a mask.
13. A resin composition for forming a resist underlayer film, comprising:
a resin that comprises an aromatic ring; and
a crosslinking agent represented by formula (B-5):
14. The resin composition according to claim 13 , wherein the resin is a novolak resin, a resol resin, an acenaphthylene resin, a styrene resin, a polyarylene resin, or a combination thereof.
15. The resin composition according to claim 13 , further comprising a solvent.
16. A resist underlayer film formed from the resin composition according to claim 13 .
17. A resist underlayer film-forming method comprising:
providing a coating film using the resin composition according to claim 13 ; and
heating the coating film.
18. A pattern-forming method comprising:
providing a resist underlayer film on an upper face side of a substrate using the resin composition according to claim 13 ;
providing a resist film on an upper face side of the resist underlayer film using a resist composition;
exposing the resist film;
developing the exposed resist film to form a resist pattern; and
sequentially dry etching the resist underlayer film and the substrate using the resist pattern as a mask.
19. A resin composition for forming a resist underlayer film, comprising:
a resin that comprises an aromatic ring; and
a crosslinking agent represented by formula (B-6):
20. The resin composition according to claim 19 , wherein the resin is a novolak resin, a resol resin, an acenaphthylene resin, a styrene resin, a polyarylene resin, or a combination thereof.
21. The resin composition according to claim 19 , further comprising a solvent.
22. A resist underlayer film formed from the resin composition according to claim 19 .
23. A resist underlayer film-forming method comprising:
providing a coating film using the resin composition according to claim 19 ; and
heating the coating film.
24. A pattern-forming method comprising:
providing a resist underlayer film on an upper face side of a substrate using the resin composition according to claim 19 ;
providing a resist film on an upper face side of the resist underlayer film using a resist composition;
exposing the resist film;
developing the exposed resist film to form a resist pattern; and
sequentially dry etching the resist underlayer film and the substrate using the resist pattern as a mask.