IP Library Patent Application 13716193
Patent Application
App. No. 13/716,193

SYSTEM AND METHOD FOR CLEANING BOND WIRE

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Quick Facts
Patent No.
US None
App. No.
13/716,193
Abstract

A system for cleaning bond wire for use by a wire bonding machine includes a bond wire supply station, a bond wire cleaning bath station, a bond wire neutralizing station, a bond wire drying station, and a wire bonding machine. In operation, the bonding machine is supplied with bond wire stored at the supply station, which is firstly de-oxidized with a cleaning solution in the cleaning bath station. Next, the cleaning solution on the bond wire is neutralized with a neutralizing liquid in the neutralizing station. The bond wire is then dried in the drying station. The speed of the bond wire passing through the cleaning bath station, neutralizing station and drying station is controlled by the wire bonding machine.

Claims (32)

1 . A system for cleaning bond wire for use by a wire bonding machine, the system comprising:

a bond wire supply station;

a bond wire cleaning bath station;

a bond wire neutralizing station;

a bond wire drying station; and

a wire bonding machine,

wherein in operation the cleaning bath station is supplied with bond wire stored at the supply station that is firstly de-oxidized with a cleaning solution in the cleaning bath station and then the cleaning solution on the bond wire is neutralized with a neutralizing liquid in the neutralizing station and then the bond wire is dried in the drying station,

wherein the speed of the bond wire passing through the cleaning bath station, neutralizing station and drying station is controlled by the wire bonding machine, and

wherein the neutralizing station includes dispensing outlets for dispensing the neutralizing liquid onto the bond wire, a reservoir for collecting the neutralizing liquid dispensed from the dispensing outlets, and a pump and conduit for re-cycling the neutralizing liquid back to the dispensing outlets.

2 . (canceled)

3 . The system of claim 1 , wherein the neutralizing liquid is water.

4 . (canceled)

5 . (canceled)

6 . The system of claim 1 , wherein the drying station includes at least one fan for blowing air onto the bond wire.

7 . The system of claim 6 , wherein the drying station includes a heater.

8 . The system of claim 1 , wherein the wire supply station includes a spool mount to allow a spool of bond wire to be pivotally mounted thereto.

9 . The system of claim 1 , wherein cleaning solution in the cleaning bath station is an acid based liquid solution.

10 . The system of claim 1 , wherein in operation the bond wire is used by the bonding machine within thirty minutes after being de-oxidized in the cleaning bath station.

11 . A method of cleaning a bond wire supplied from a bond wire supply station to a wire bonding machine, the method comprising:

de-oxidizing the bond wire, supplied from the supply station, in a cleaning bath station with a cleaning solution;

neutralizing the cleaning solution on the bond wire by dispensing a neutralizing liquid onto the bond wire with dispensing outlets, wherein the neutralizing liquid dispensed from the dispensing outlets is collected by a reservoir and re-cycled back to the dispensing outlets by a pump and conduit;

drying the bond wire in the drying station to provide a de-oxidized bond wire; and

using the de-oxidized bond wire in a wire bonding machine, wherein the speed of de-oxidizing, neutralizing, and drying the bond wire is controlled by the wire bonding machine.

12 . (canceled)

13 . The method of cleaning a bond wire of claim 12 , wherein the neutralizing liquid is water.

14 . (canceled)

15 . (canceled)

16 . The method of cleaning a bond wire of claim 11 , wherein the drying includes blowing air onto the bond wire.

17 . The method of cleaning a bond wire of claim 16 , wherein the air is heated.

18 . The method of cleaning a bond wire of claim 11 , wherein bond wire is supplied from the supply station by spooling, and the speed of spooling is controlled by the wire bonding machine.

19 . The method of cleaning a bond wire of claim 11 , wherein the cleaning solution is an acid based liquid solution.

20 . The method of cleaning a bond wire of claim 11 , wherein the using the de-oxidized bond wire in the wire bonding machine is within thirty minutes after the process of de-oxidizing the bond wire.

Assignments (18)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
PATENT RELEASE Recorded Jan 14, 2016
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037494/0312 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0671 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0685 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Apr 22, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030258/0558 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Apr 22, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 030258/0540 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Apr 22, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030258/0523 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 16, 2012
From: IBRAHIM, MOHD RUSLI; AU, YIN KHENG; EU, POH LENG
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 029476/0813 →