Semiconductor device and information processing system including the same
View Patent ↗A semiconductor device includes a semiconductor substrate, first and second penetration electrodes each penetrating the semiconductor substrate, a multi-level wiring structure formed on the semiconductor substrate, the multi-level wiring structure including a lower-level wiring, an upper-level wiring and an interlayer insulating film between the lower-level wiring and the upper-level wiring, a first wiring pad formed as the lower-level wiring and electrically connected to the first penetration electrode, a second wiring pad formed as the upper-level wiring, a plurality of first through electrodes each formed in the interlayer insulating film to form an electrical connection between the first and second wiring pads, a third wiring pad formed as the lower-level wiring and electrically connected to the second penetration electrode, a fourth wiring pad formed as the upper-level wiring, and a plurality of second through electrodes each formed in the interlayer insulating film.
1. A semiconductor device comprising:
a semiconductor substrate;
first and second penetration electrodes each penetrating the semiconductor substrate;
a multi-level wiring structure formed on the semiconductor substrate, the multi-level wiring structure comprising a lower-level wiring, an upper-level wiring and an interlayer insulating film between the lower-level wiring and the upper-level wiring;
a first wiring pad formed as the lower-level wiring and electrically connected to the first penetration electrode;
a second wiring pad formed as the upper-level wiring;
a plurality of first through electrodes each formed in the interlayer insulating film to form an electrical connection between the first and second wiring pads;
a third wiring pad formed as the lower-level wiring and electrically connected to the second penetration electrode;
a fourth wiring pad formed as the upper-level wiring; and
a plurality of second through electrodes each formed in the interlayer insulating film to form an electrical connection between the third and fourth wiring pads,
wherein a number of the first through electrodes is greater than a number of the second through electrodes.
2. The semiconductor device as claimed in claim 1 , wherein a size of the first penetration electrode is substantially the same as a size of the second penetration electrode.
3. The semiconductor device as claimed in claim 1 , wherein the first penetration electrode is configured to be supplied with a power source voltage and the second penetration electrode is configured to be supplied with a signal.
4. The semiconductor device as claimed in claim 3 , wherein a size of the first wiring pad is greater than a size of the third wiring pad.
5. The semiconductor device as claimed in claim 4 , wherein a size of the second wiring pad is greater than a size of the fourth wiring pad.
6. The semiconductor device as claimed in claim 3 , wherein a size of the first wiring pad is greater than a size of the second wiring pad.
7. The semiconductor device as claimed in claim 1 , wherein the first and second penetration electrodes are coupled to the first and third wiring pads at top surfaces thereof, respectively, and
wherein the semiconductor device further comprises:
a first bump connected to a bottom surface of the first penetration electrode; and
a second bump connected to a bottom surface of the second penetration electrode, a size of the second bump being substantially the same as a size of the first bump.
8. The semiconductor device as claimed in claim 7 , wherein each of the second and fourth wiring pads is formed as a top-level wiring of the multi-level wiring structure, the semiconductor device further comprising:
a third bump formed on the second wiring pad; and
a fourth bump formed on the fourth wiring pad, a size of the fourth bump being substantially the same as a size of the third bump.
9. A semiconductor device comprising:
a semiconductor substrate;
first and second penetration electrodes each penetrating the semiconductor substrate;
a multi-level wiring structure formed on the semiconductor substrate, the multi-level wiring structure comprising a lower-level wiring, an upper-level wiring and an interlayer insulating film between the lower-level wiring and the upper-level wiring;
a first wiring pad formed as the lower-level wiring and electrically connected to the first penetration electrode;
a second wiring pad formed as the upper-level wiring; a plurality of first through electrodes each formed in the interlayer insulating film to form an electrical connection between the first and second wiring pads;
a third wiring pad formed as the lower-level wiring and electrically connected to the second penetration electrode;
a fourth wiring pad formed as the upper-level wiring; and
a plurality of second through electrodes each formed in the interlayer insulating film to form an electrical connection between the third and fourth wiring pads,
wherein the first wiring pad comprises a plurality of connection surface areas each connecting to a corresponding one of the first through electrodes, the second wiring pad comprises a plurality of connection surface areas each connecting to a corresponding one of the second through electrodes, and a sum of the connection surface areas of the first wiring pad is greater than a sum of the connection surface areas of the second wiring pad.
10. The semiconductor device as claimed in claim 9 , wherein a size of the first penetration electrode is substantially the same as a size of the second penetration electrode.
11. The semiconductor device as claimed in claim 9 , wherein a size of the first wiring pad is greater than a size of the third wiring pad.
12. The semiconductor device as claimed in claim 9 , wherein a size of the second wiring pad is greater than a size of the fourth wiring pad.
13. The semiconductor device as claimed in claim 9 , wherein the first penetration electrode is configured to be supplied with a power source voltage and the second penetration electrode is configured to be supplied with a signal.
14. The semiconductor device as claimed in claim 9 , wherein a size of the first wiring pad is greater than a size of the second wiring pad.
15. The semiconductor device as claimed in claim 9 , wherein the first and second penetration electrodes are coupled to the first and third wiring pads at top surfaces thereof, respectively, and
wherein the semiconductor device further comprises:
a first bump electrically connected to a bottom surface of the first penetration electrode; and
a second bump electrically connected to a bottom surface of the second penetration electrode, a size of the second bump being substantially the same as a size of the first bump.
16. The semiconductor device as claimed in claim 15 , wherein each of the second and fourth wiring pads is formed as a top-level wiring of the multi-level wiring structure, the semiconductor device further comprising:
a third bump formed on the second wiring pad; and
a fourth bump formed on the fourth wiring pad, a size of the fourth bump being substantially the same as a size of the third bump.
17. A semiconductor device comprising:
a semiconductor substrate;
first and second penetration electrodes each penetrating the semiconductor substrate;
a multi-level wiring structure formed on the semiconductor substrate, the multi-level wiring structure comprising a lower-level wiring, an upper-level wiring and an interlayer insulating film between the lower-level wiring and the upper-level wiring;
a first wiring pad formed as the lower-level wiring and electrically connected to the first penetration electrode;
a second wiring pad formed as the upper-level wiring;
a plurality of first through electrodes each formed in the interlayer insulating film to form an electrical connection between the first and second wiring pads;
a third wiring pad formed as the lower-level wiring and electrically connected to the second penetration electrode;
a fourth wiring pad formed as the upper-level wiring; and
a plurality of second through electrodes each formed in the interlayer insulating film to form an electrical connection between the third and fourth wiring pads,
wherein cross sections of the first and third wiring pads respectively comprise top and bottom sides, and a length of the top and bottom sides of the first wiring pad is greater than a length of the top and bottom sides of the third wiring pad.
18. The semiconductor device as claimed in claim 17 , wherein the first penetration electrode is configured to be supplied with a power source voltage and the second electrode is configured to be supplied with a signal.
19. The semiconductor device as claimed in claim 18 , wherein a cross section of the second wiring pad comprises top and bottom sides, and a length of the top and bottom sides of the first wiring pad is greater than a length of the top and bottom sides of the second wiring pad.
20. The semiconductor device as claimed in claim 19 , further comprising a signal wiring electrically independent of the first and second wiring pads, the signal wiring being formed adjacently to the second wiring pad such that the signal wiring is located over the first wiring pad.