IP Library Granted Patent US 8,909,097
Granted Patent B2
US 8,909,097 · App. 13/720,392 · Granted Dec 9, 2014

Systems and methods for remanufacturing imaging components

Inventors: Jonathan W. Martin (Fayetteville, NC); Donald R. Huck (Sanford, NC); Patrick J. Novak (Raleigh, NC)
Assignee: Static Control Components, Inc.
G03G15/0894
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Quick Facts
Patent No.
US 8,909,097
App. No.
13/720,392
Granted
Dec 9, 2014
Kind
B2
Abstract

Techniques for modifying an imaging cartridge includes providing the imaging cartridge comprising a body including a circuit holding structure sized to hold an electronic circuit and forming a modified circuit holding structure, with the modified circuit holding structure sized to hold a replacement electronic circuit. At least one dimension of the replacement electronic circuit may be greater than a corresponding dimension of the electronic circuit.

Claims (12)

1. A method of modifying an imaging cartridge comprising the steps of:

providing the imaging cartridge comprising a body including a circuit holding structure sized to hold an electronic circuit;

providing a jig having a cartridge receiving area that is shaped to receive the imaging cartridge and a guide hole;

placing the imaging cartridge in the cartridge receiving area, wherein the circuit holding area is located adjacent the guide hole of the jig;

providing a removal tool for removing a portion of the circuit holding structure; and

guiding the removal tool using guide hole to remove a predetermined amount of material from the circuit holding structure.

2. The method of claim 1 wherein the removal tool is a drill bit having a stop collar and the stop collar engages the guide hole to limit a depth of drilling.

3. The method of claim 1 further comprising the step of attaching a replacement chip in the circuit holding area.

4. The method of claim 3 further comprising placing a flexible thin film member over a portion of the replacement chip and a portion of the circuit holding structure.

5. The method of claim 1 wherein there is a gap formed by removing a portion of the circuit holding area and a portion of the replacement chip covers the gap.

6. The method of claim 1 wherein there is a gap formed by removing a portion of the circuit holding area and the gap is filled with a material.

7. The method of claim 1 wherein there is a gap formed by removing a portion of the circuit holding area and the gap is covered by a flexible thin film member.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2024
From: BANK OF AMERICA, N.A.
To: STATIC CONTROL COMPONENTS, INC.; SC COMPONENTS CANADA, INC.; LEE AVENUE PROPERTIES, INC.; SANTRONICS, INC.
Reel/Frame 066782/0781 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2020
From: STATIC CONTROL COMPONENTS, INC.
To: APEX SEMICONDUCTORS (USA) COMPANY LIMITED
Reel/Frame 054727/0735 →
RELEASE OF SECURITY INTEREST Recorded Dec 22, 2020
From: BANK OF AMERICA, N.A.
To: STATIC CONTROL COMPONENTS, INC.
Reel/Frame 055327/0513 →
SECURITY INTEREST Recorded Dec 23, 2016
From: STATIC CONTROL COMPONENTS, INC.; SANTRONICS, INC.; SC COMPONENTS CANADA, INC.; LEE AVENUE PROPERTIES, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 041182/0601 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2013
From: MARTIN, JONATHAN W, MR; HUCK, DONALD R, MR; NOVAK, PATRICK J, MR
To: STATIC CONTROL COMPONENTS, INC.
Reel/Frame 030828/0058 →
Continuity (2)
Provisional Application 61726068 · Nov 14, 2012
Related Publication 20140133883A1 · May 15, 2014