IP Library Granted Patent US 8,823,483
Granted Patent B2
US 8,823,483 · App. 13/725,018 · Granted Sep 2, 2014

Power resistor with integrated heat spreader

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,823,483
App. No.
13/725,018
Granted
Sep 2, 2014
Kind
B2
Abstract

An integrated assembly includes a resistor and a heat spreader. The resistor includes a resistive element and terminals. The heat spreader is integrated with the resistor and includes a heat sink of thermally conducting and electrically insulating material and terminations of a thermally conducting material and situated at an edge of the heat sink. At least a portion of a top surface of the resistive element is in thermally conductive contact with the heat sink. Each resistor terminal is in thermally conductive contact with a corresponding termination of the heat sink. A method of fabricating an integrated assembly of a resistor and a heat spreader includes forming the heat spreader, forming the resistor, and joining the heat spreader to the resistor by bonding at least a portion of a top surface of the resistive element to the heat sink and bonding each electrically conducting terminal to a corresponding termination.

Claims (52)

1. An integrated assembly of a resistor and a heat spreader, comprising:

a resistor comprising:

a resistive element having a top surface; and

terminals in electrical contact with the resistive element; and

a heat spreader integrated with the resistor, the heat spreader comprising:

a heat sink comprising a piece of thermally conducting and electrically insulating material; and

terminations comprised of a thermally conducting material and situated at an edge of the heat sink;

wherein at least a portion of the top surface of the resistive element is in thermally conductive contact with the heat sink; and

each terminal is in thermally and electrically conductive contact with a corresponding one of the terminations.

2. The integrated assembly of claim 1 wherein at least one of the terminals is straight in all dimensions.

3. The integrated assembly of claim 1 wherein at least one of the terminals comprises a deposited electrically conducting material.

4. The integrated assembly of claim 1 , further comprising a thermally conductive and electrically insulating adhesive between the heat sink and the resistive element.

5. The integrated assembly of claim 4 , wherein the adhesive does not extend over the terminals and does not extend over the terminations.

6. The integrated assembly of claim 1 , wherein the heat sink comprises a ceramic.

7. The integrated assembly of claim 6 , wherein the ceramic comprises at least one of alumina, aluminum nitride, or beryllia.

8. The integrated assembly of claim 1 , wherein the heat sink comprises a metallic material and the terminations are electrically isolated from the metallic material.

9. The integrated assembly of claim 8 , wherein the metallic material comprises at least one of: insulated metal substrate, electrically passivated metal, or electrically unpassivated metal.

10. The integrated assembly of claim 1 , wherein the terminations are situated only on a surface of the heat sink that is in thermally conductive contact with the resistive element.

11. The integrated assembly of claim 1 , wherein the terminations are situated on a surface of the heat sink that is in thermally conductive contact with the resistive element and the terminations extend over an end surface and a back surface of the heat sink.

12. The integrated assembly of claim 1 , wherein the terminations are situated only on an edge surface of the heat sink.

13. The integrated assembly of claim 1 , wherein the resistive element is a metal strip resistive element.

14. The integrated assembly of claim 1 , wherein the terminals and the terminations are both thermally and electrically conducting.

15. The integrated assembly of claim 1 , wherein the terminals and the terminations are both metallic.

16. A method of fabricating an integrated assembly of a resistor and a heat spreader, comprising:

forming the heat spreader by fabricating thermally conducting terminations on a thermally conducting and electrically insulating heat sink, wherein the heat sink and the terminations are in thermally conducting contact with one another;

forming a resistor by fabricating electrically conducting terminals in electrical contact with a resistive element; and

joining the heat spreader to the resistor by:

bonding at least a portion of a top surface of the resistive element to the heat sink to form thermally conductive contact between the resistive element and the heat sink; and

bonding each of the electrically conducting terminals to a corresponding one of the terminations to form thermally and electrically conductive contact between the terminals and the terminations.

17. The method of claim 16 , wherein the terminations are formed only on edge surfaces of the heat sink.

18. The method of claim 16 , wherein the terminations are fabricated with a thick film process.

19. The method of claim 16 , wherein fabricating electrically conducting terminals in electrical contact with a resistive element comprises attaching unbent pieces of metal to the resistive element.

20. The method of claim 16 , wherein fabricating electrically conducting terminals in electrical contact with a resistive element comprises depositing an electrically conducting material on the resistive element.

21. The method of claim 16 , wherein the bonding of at least a portion of the top surface of the resistive element to the heat sink is done with a thermally conducting, electrically insulating adhesive.

22. The method of claim 16 , wherein the bonding of each of the electrically conducting terminals to a corresponding one of the terminations is done using at least one of solder or electrically conductive adhesive, thereby making both thermally and electrically conducting contact between the terminals and the terminations.

23. An integrated assembly of a resistor and a heat spreader, comprising:

a resistor comprising:

a resistive element having a top surface; and

terminals in electrical contact with the resistive element; and

a heat spreader integrated with the resistor, the heat spreader comprising:

a heat sink comprising a piece of thermally conducting and electrically insulating material; and

terminations comprised of a thermally conducting material and situated at an edge of the heat sink;

wherein at least a portion of the top surface of the resistive element is in thermally conductive contact with the heat sink; and

each terminal is in thermally conductive contact with a corresponding one of the terminations.

24. The integrated assembly of claim 23 , wherein each terminal is in electrically conductive contact with a corresponding one of the terminations.

25. A method of fabricating an integrated assembly of a resistor and a heat spreader, comprising:

forming the heat spreader by fabricating thermally conducting terminations on a thermally conducting and electrically insulating heat sink, wherein the heat sink and the terminations are in thermally conducting contact with one another;

forming a resistor by fabricating electrically conducting terminals in electrical contact with a resistive element; and

joining the heat spreader to the resistor by:

bonding at least a portion of a top surface of the resistive element to the heat sink to form thermally conductive contact between the resistive element and the heat sink; and

bonding each of the electrically conducting terminals to a corresponding one of the terminations to form thermally conductive contact between the terminals and the terminations.

26. The method of claim 25 , wherein the formed thermally conductive contact between the terminals and the terminations is also electrically conductive.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE
Reel/Frame 049772/0898 →
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
CHANGE OF NAME Recorded Feb 25, 2016
From: VISHAY DALE ELECTRONICS, INC.
To: VISHAY DALE ELECTRONICS, LLC
Reel/Frame 037915/0828 →
SECURITY AGREEMENT Recorded Dec 10, 2015
From: VISHAY DALE ELECTRONICS, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037261/0616 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2013
From: SMITH, CLARK; WYATT, TODD
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 031128/0477 →