IP Library Granted Patent US 9,062,865
Granted Patent B2
US 9,062,865 · App. 13/728,543 · Granted Jun 23, 2015

Housing and light emitting device having the same

Inventors: Shih-Chang Wang (Taoyuan Hsien, TW); Po-Chang Li (Taoyuan Hsien, TW); Ming-Chih Lai (Taoyuan Hsien, TW); Pin-Hao Hsu (Taoyuan Hsien, TW)
Assignee: Lite-On Technology Corporation
F21V29/004F21V29/20F21V23/0464F21W2131/10F21Y2101/02F21V29/507F21V29/89
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Quick Facts
Patent No.
US 9,062,865
App. No.
13/728,543
Granted
Jun 23, 2015
Kind
B2
Abstract

A housing of light emitting device including a first part for accommodating a light emitting diode module and providing a space for heat dissipation is disclosed. The first part includes an outline casing forming an enclosed room and at least one heat conductive structure disposed inside the enclosed room. The heat conductive structure couples to a heat dissipating side and a light emitting side of the outline casing.

Claims (46)

1. A housing of light emitting device, comprising:

a first part for accommodating a light emitting diode module and providing a space for heat dissipation, the first part comprising an outline casing forming an enclosed room and at least one heat conductive structure disposed inside the enclosed room, wherein the outline casing includes a heat dissipating side, a light emitting side opposite to the heat dissipating side, and two lateral sides,

wherein the heat dissipating side, the light emitting side and the two lateral sides form the enclosed room, and

wherein the at least one heat conductive structure connects between the heat dissipating side and the light emitting side of the outline casing.

2. The housing according to claim 1 , further comprising:

a second part coupling to the first part used for accommodating electronic elements of the light emitting diode module.

3. The housing according to claim 2 , wherein the first part comprising a first side and a second side opposite to the first side, the second part is connected to the second side of the first part, and wherein the housing further comprising:

a cover for covering the first side of the first part.

4. The housing according to claim 1 , wherein the first part comprises a plurality of heat conductive structures, wherein each of the heat conductive structures are disposed in non parallel relation with respect to one another inside the enclosed room and are outwardly diverged from the light emitting side to the heat dissipating side of the outline casing.

5. The housing according to claim 1 , wherein the outline casing is dome shape or plat shape, the heat dissipating side of the outline casing is arc-shape.

6. The housing according to claim 1 , wherein an outer side of the light emitting side comprising at least one groove for accommodating electrical wires of the light emitting diode module.

7. The housing according to claim 1 , wherein the outline casing has a concave space formed at the light emitting side of the outline casing for accommodating the light emitting diode module.

8. The housing according to claim 1 , further comprising:

a screw hole disposed at a connecting portion between the at least one heat conductive structure and the outline casing.

9. The housing according to claim 1 , wherein the at least one heat conductive structure and the outline casing are formed integrally.

10. The housing according to claim 1 , further comprising:

a sunlight sensing element for sensing sunlight.

11. A light emitting device, comprising:

a light emitting diode module for providing light; and

a housing covering the light emitting diode module, the housing comprising a first part, the first part comprising an outline casing forming an enclosed room and at least one heat conductive structure disposed inside the enclosed room,

wherein the outline casing includes a heat dissipating side, a light emitting side opposite to the heat dissipating side, and two lateral sides,

wherein the heat dissipating side, the light emitting side and the two lateral sides form the enclosed room, and

wherein the at least one heat conductive structure connects between the heat dissipating side and the light emitting side of the outline casing.

12. The light emitting device according to claim 11 , further comprising:

a second part coupling to the first part used for accommodating electronic elements of the light emitting diode module.

13. The light emitting device according to claim 12 , wherein the first part comprising a first side and a second side opposite to the first side, the second part is connected to the second side of the first part, and wherein the housing further comprising:

a cover for covering the first side of the first part.

14. The light emitting device according to claim 11 , wherein the first part comprises a plurality of heat conductive structures, wherein each of the heat conductive structures are disposed in non parallel relation with respect to one another inside the enclosed room and are outwardly diverged from the light emitting side to the heat dissipating side of the outline casing.

15. The light emitting device according to claim 11 , wherein the outline casing is dome shape or plat shape, the heat dissipating side of the outline casing is arc-shape.

16. The light emitting device according to claim 11 , wherein an outer side of the light emitting side comprising:

at least one groove for accommodating electrical wires of the light emitting diode module.

17. The light emitting device according to claim 11 , wherein the outline casing has a concave space formed at the light emitting side of the outline casing for accommodating the light emitting diode module.

18. The light emitting device according to claim 11 , further comprising:

a screw hole disposed at a connecting portion between the at least one heat conductive structure and the outline casing.

19. The light emitting device according to claim 11 , wherein the at least one heat conductive structure and the outline casing are formed integrally.

20. The light emitting device according to claim 11 , further comprising:

a sunlight sensing element for sensing sunlight.

21. A light emitting device, comprising:

a light emitting diode module for providing light; and

a housing covering the light emitting diode module, the housing comprising a first part, the first part comprising an outline casing forming an enclosed room and a plurality of heat conductive structures disposed inside the enclosed room,

wherein each of the heat conductive structures are disposed in non parallel relation with respect to one another inside the enclosed room,

wherein the outline casing includes a heat dissipating side, a light emitting side opposite to the heat dissipating side, and two lateral sides, and

wherein all of the sides of the outline casing form the enclosed room.

22. The light emitting device according to claim 21 , wherein the outline casing includes a heat dissipating side and a light emitting side, and each of the heat conductive structures connects the heat dissipating side and the light emitting side of the outline casing.

23. The light emitting device according to claim 21 , wherein the outline casing includes a heat dissipating side and a light emitting side, and each of the heat conductive structures are outwardly diverged from the light emitting side to the heat dissipating side of the outline casing.

24. The light emitting device according to claim 21 , wherein the outline casing includes a heat dissipating side, a light emitting side opposite to the heat dissipating side, and two lateral sides, wherein all of the sides of the outline casing form the enclosed room.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 4, 2022
From: LITE-ON TECHNOLOGY CORPORATION
To: LEOTEK CORPORATION
Reel/Frame 059804/0585 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE/ASSIGNOR TRANSPOSED IN THE ASSIGNMENT PREVIOUSLY RECORDED AT REEL: 033166 FRAME: 0662. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jun 27, 2014
From: LEOTEK ELECTRONICS CORPORATION
To: LITE-ON TECHNOLOGY CORPORATION
Reel/Frame 033247/0149 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2014
From: LITE-ON TECHNOLOGY CORPORATION
To: LEOTEK ELECTRONICS CORPORATION
Reel/Frame 033166/0662 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 16, 2013
From: WANG, SHIH-CHANG; LI, PO-CHANG; LAI, MING-CHIH; HSU, PIN-HAO
To: LEOTEK ELECTRONICS CORPORATION
Reel/Frame 029638/0951 →
Continuity (2)
Provisional Application 61608669 · Mar 9, 2012
Related Publication 20130235595A1 · Sep 12, 2013