Energy storage devices formed with porous silicon
In one embodiment, an energy storage device (e.g., capacitor) may include a porous silicon layer formed within a substrate. The porous silicon layer includes pores with a mean pore diameter less than approximately 100 nanometers. A first conductive layer is formed on the porous silicon layer and a first dielectric layer is formed on the first conductive layer. A second conductive layer is formed on the first dielectric layer to form the capacitor.
1. An energy storage device, comprising:
a mesoporous silicon layer formed within a substrate by electrochemically etching the substrate with no photolithography, the mesoporous silicon layer having pores with tapered pore openings and with a mean pore diameter of approximately 50 nanometers or less;
a first conductive layer formed on the mesoporous silicon layer;
a first dielectric layer formed on the first conductive layer; and
a second conductive layer formed on the first dielectric layer.
2. The energy storage device of claim 1 , further comprising:
a second dielectric layer formed on the second conductive layer; and
a third conductive layer formed on the second dielectric layer.
3. The energy storage device of claim 2 , wherein at least one of the first and second dielectric layers includes a giant dielectric constant of approximately 5000 or greater.
4. The energy storage device of claim 1 , wherein at least one of the first conductive layer, the first dielectric layer, and the second conductive layer is formed by atomic layer deposition.
5. The energy storage device of claim 1 , wherein the first conductive layer includes a silicon carbide layer or a silicon layer coated by a layer of carbon that is formed by carbonization of the mesoporous silicon layer using at least one gas phase treatment.
6. The energy storage device of claim 1 , wherein the first conductive layer includes a hydrocarbon-terminated silicon layer that is formed by carbonization of the mesoporous silicon layer using at least one gas phase treatment at a temperature less than approximately 650 degrees Celsius.
7. The energy storage device of claim 1 , wherein the first dielectric layer includes a high-k dielectric constant greater than 4 that can be used for high frequency decoupling applications of one or more Ghz.
8. The energy storage device of claim 1 , wherein the mesoporous silicon layer includes pores with a mean pore diameter between approximately 50 nanometers and approximately 2 nanometers.
9. The energy storage device of claim 1 , wherein the mesoporous silicon layer includes pores with a mean pore depth of approximately 10 microns.
10. The energy storage device of claim 1 , wherein the mesoporous silicon layer is formed within the substrate by electrochemically etching the substrate to form tapered pores.
11. A device, comprising:
a substrate;
a microprocessor over the substrate; and
an energy storage device associated with the microprocessor, the energy storage device comprises a mesoporous silicon layer formed within the substrate by electrochemically etching the substrate with no photolithography, the mesoporous silicon layer having pores with tapered pore openings and with a mean pore diameter of approximately 50 nanometers or less;
a first conductive layer formed on the mesoporous silicon layer;
a first dielectric layer formed on the first conductive layer; and
a second conductive layer formed on the first dielectric layer.
12. The device of claim 11 , further comprising:
a second dielectric layer formed on the second conductive layer; and
a third conductive layer formed on the second dielectric layer.
13. The device of claim 12 , wherein at least one of the first and second dielectric layers includes a giant dielectric constant of approximately 5000 or greater.
14. The device of claim 11 , wherein the energy storage device provides power to the microprocessor.
15. The device of claim 11 , wherein the first conductive layer includes a silicon carbide layer or a silicon layer coated by a layer of carbon that is formed by carbonization of the mesoporous silicon layer using at least one gas phase treatment.
16. The device of claim 11 , wherein the first conductive layer includes a hydrocarbon-terminated silicon layer that is formed by carbonization of the mesoporous silicon layer using at least one gas phase treatment at a temperature less than approximately 650 degrees Celsius, wherein the first dielectric layer includes a high-k dielectric constant greater than 4 and allows the energy storage device to be used for high frequency decoupling applications.
17. The device of claim 11 , wherein the mesoporous silicon layer includes pores with a mean pore diameter less than 50 nanometers, wherein the energy storage device acts to prevent voltage droops in a power supply, wherein the mesoporous silicon layer is formed within the substrate by electrochemically etching the substrate to form tapered pores.
18. An energy storage device, comprising:
a mesoporous silicon layer formed within a substrate by electrochemically etching the substrate with no photolithography, the mesoporous silicon layer having pores with tapered pore openings and with a mean pore diameter of approximately 50 nanometers or less;
a dielectric layer formed on the mesoporous silicon layer; and
a conductive layer formed on the dielectric layer.
19. The energy storage device of claim 18 , further comprising:
an additional dielectric layer formed on the conductive layer; and
an additional conductive layer formed on the additional dielectric layer.
20. The energy storage device of claim 18 , wherein the mesoporous silicon layer is doped to form a first electrode while the conductive layer forms a second electrode.