Embedded package in PCB build up
View Patent ↗An apparatus including a printed circuit board including a body of a plurality of alternating layers of conductive material and insulating material; and a package including a die disposed within the body of the printed circuit board. A method including forming a printed circuit board including a core and a build-up section including alternating layers of conductive material and insulating material coupled to the core; and coupling a package including a die to the core of the printed circuit board such that at least a portion of a sidewall of the package is embedded in at least a portion of the build-up section. An apparatus including a printed circuit board including a body; a computing device including a package including a microprocessor disposed within the body of the printed circuit board; and a peripheral device that provides input or output to the computing device.
1. An apparatus comprising:
a printed circuit board comprising a body of a plurality of alternating layers of conductive material and insulating material; and
a package comprising a die disposed within the body of the printed circuit board, wherein the package comprises a plurality of package contact points coupled to contact points of the die and at least one of the package contact points is coupled to the one of the plurality of conductive material of the printed circuit board,
wherein the package comprises a first side comprising the plurality of external package contact points and a second side opposite the first side, wherein a portion of the second side is exposed in a surface of the printed circuit board.
2. The apparatus of claim 1 , wherein the plurality of alternating layers of conductive material of the printed circuit board comprise at least one patterned signal layer and at least one of the package contact points is coupled to the at least one patterned signal layer.
3. The apparatus of claim 1 , wherein the plurality of alternating layers of conductive material of the printed circuit board comprise at least one patterned signal layer and at least one reference layer, wherein the plurality of package contact points is coupled to the at least one patterned signal layer and the at least one reference layer.
4. The apparatus of claim 1 , wherein the package comprises a first side comprising the plurality of external package contact points and a second side opposite the first side, wherein each of the first side and the second side are embedded in the printed circuit board.
5. The apparatus of claim 1 , wherein the package comprises a first side and a second side opposite the first side, wherein a first portion of the plurality of package contact points are disposed on the first side of the package and a second portion of the plurality of package contact points are disposed on the second side of the package.
6. The apparatus of claim 5 , wherein the die is disposed in the package with a device side oriented toward the first side of the package.
7. The apparatus of claim 1 , wherein the body of the printed circuit board comprises a core and the package and the plurality of alternating layers of conductive material and insulating material are disposed on the core.
8. An apparatus comprising:
a printed circuit board comprising a body of a plurality of alternating layers of conductive material and insulating material;
a computing device comprising a package comprising a microprocessor disposed within the body of the printed circuit board, wherein the package comprises a plurality of package contact points coupled to contact points of the die and at least one of the package contact points is coupled to the one of the plurality of conductive material of the printed circuit board; and
a peripheral device that provides input or output to the computing device.
9. The apparatus of claim 8 , wherein the printed circuit board and peripheral device are embodied in a hand-held product.
10. The apparatus of claim 8 , wherein the package comprises a first side and a second side opposite the first side, wherein a first portion of the plurality of package contact points are disposed on the first side of the package and a second portion of the plurality of package contact points are disposed on the second side of the package, the apparatus further comprising a memory device coupled to the second portion of the plurality of package contact points.