Semiconductor device with molded casing and package interconnect extending therethrough, and associated systems, devices, and methods
Methods for making semiconductor devices are disclosed herein. A method configured in accordance with a particular embodiment includes forming a spacer material on an encapsulant such that the encapsulant separates the spacer material from an active surface of a semiconductor device and at least one interconnect projecting away from the active surface. The method further includes molding the encapsulant such that at least a portion of the interconnect extends through the encapsulant and into the spacer material. The interconnect can include a contact surface that is substantially co-planar with the active surface of the semiconductor device for providing an electrical connection with the semiconductor device.
1. A method for manufacturing a semiconductor device assembly, comprising:
disposing an encapsulant between a spacer material and an active surface of a semiconductor device, wherein the encapsulant separates the spacer material from at least one interconnect projecting away from the active surface; and
molding the encapsulant such that at least a portion of the interconnect extends through the encapsulant and into the spacer material, wherein molding the encapsulant includes pressing the portion of the interconnect through the encapsulant and into the spacer material.
2. The method of claim 1 , further comprising:
forming a passivation material between the active surface of the semiconductor device and the encapsulant; and
forming the interconnect, wherein forming the interconnect includes forming a bond pad on the passivation material; and
plating a conductive material on the bond pad.
3. The method of claim 2 wherein plating the conductive material on the bond pad comprises forming a conductive pillar having a projection height greater than a thickness of the encapsulant between the spacer material and the passivation material.
4. The method of claim 2 , further comprising:
forming a redistribution network on the passivation material, wherein the redistribution network includes the bond pad and at least one conductive trace coupled to the bond pad; and
forming a wirebond electrically coupled to the bond pad via the conductive trace of the redistribution network.
5. The method of claim 1 wherein the active surface of the semiconductor device comprises a bond pad, and wherein the method further comprises forming the interconnect by electroplating a conductive material onto the bond pad.
6. The method of claim 1 wherein molding the encapsulant comprises forming a casing that at least partially encapsulates the semiconductor device with the encapsulant.
7. The method of claim 1 wherein the semiconductor device comprises a first semiconductor die having an active surface that includes the active surface of the semiconductor device, and wherein the method further comprises:
attaching a second semiconductor die to a support substrate;
attaching the first semiconductor die to the second semiconductor die; and
wirebonding one or more first bond pads at the active surface of the first semiconductor die to one or more second bond pads at the support substrate.
8. The method of claim 1 wherein the semiconductor device and the encapsulant form at least a portion of a first semiconductor device package, and wherein the method further comprises:
attaching a second semiconductor device package to the first semiconductor device package, wherein the second semiconductor device package includes a contact electrically coupled to the first device package via the portion of the interconnect that extends through the encapsulant.
9. The method of claim 8 wherein the portion of the interconnect that extends through the encapsulant comprises a first interconnect, and wherein attaching the second semiconductor device package to the first semiconductor device package comprises forming a second interconnect at the first interconnect, wherein the second interconnect fits within a planform shape defined by the first semiconductor device package.
10. The method of claim 8 wherein attaching the second semiconductor device package to the first semiconductor device package comprises forming a solder ball at the portion of the interconnect that extends through the encapsulant.
11. The method of claim 8 , further comprising forming a redistribution network at the active surface of the semiconductor device of the first semiconductor device package, wherein the interconnect electrically couples the second semiconductor device with the redistribution network.
12. The method of claim 8 wherein the semiconductor device of the first semiconductor device package comprises a semiconductor die having an active surface that includes the active surface of the semiconductor device, and wherein the method further comprises:
forming a redistribution network at the active surface of the semiconductor die of the first semiconductor device package, wherein the redistribution network includes the interconnect, and wherein the interconnect electrically couples the second semiconductor device to the redistribution network without providing an electrical coupling between the second semiconductor device and the semiconductor die of the first semiconductor device package.
13. The method of claim 1 wherein pressing the portion of the interconnect through the encapsulant and into the spacer material includes pressing a plate of a molding apparatus and the active surface of the semiconductor device towards one another to drive away a portion of the encapsulant between the active surface and the plate.
14. The method of claim 1 , further comprising:
removing the spacer material;
disposing solder on the portion of the interconnect; and
reflowing the solder.
15. The method of claim 1 wherein the interconnect has a planar surface facing away from the active surface, and wherein molding the encapsulant further includes pressing the planar surface through the encapsulant and into the spacer material.