Semiconductor device and method for manufacturing the same
A metal element of a metal film is introduced into the oxide semiconductor film by performing heat treatment in the state where the oxide semiconductor film is in contact with the metal film, so that a low-resistance region having resistance lower than that of a channel formation region is formed. A region of the metal film, which is in contact with the oxide semiconductor film, becomes a metal oxide insulating film by the heat treatment. After that, an unnecessary metal film is removed. Thus, the metal oxide insulating film can be formed over the low-resistance region.
1. A semiconductor device comprising:
an oxide semiconductor film comprising a channel formation region and a first region;
a gate insulating film over and in contact with the oxide semiconductor film;
a first insulating film over and in contact with the first region, the first insulating film comprising an oxide of a metal element;
a gate electrode over and in contact with the gate insulating film, the gate electrode overlapping with the channel formation region; and
a second insulating film over and in contact with the gate electrode and the first insulating film,
wherein an entire top surface of the first insulating film is lower than a bottom surface of the gate electrode,
wherein the first region comprises the metal element, and
wherein an entire end portion of the first region is covered with the first insulating film.
2. The semiconductor device according to claim 1 , wherein the oxide semiconductor film comprises In, Ga, and Zn.
3. The semiconductor device according to claim 1 , further comprising:
a sidewall insulating film on a side surface of the gate electrode,
wherein the second insulating film is over and in contact with the sidewall insulating film,
wherein the oxide semiconductor film comprises a second region between the first region and the channel formation region, the second region overlapping with the sidewall insulating film, and
wherein a resistance of the first region differs from a resistance of the second region.
4. The semiconductor device according to claim 1 , wherein the gate insulating film comprises a first gate insulating film and a second gate insulating film over the first gate insulating film.
5. The semiconductor device according to claim 1 ,
wherein the oxide semiconductor film comprises chlorine, and
wherein the oxide semiconductor film has a chlorine concentration of 2×10 18 atoms/cm 3 or lower.
6. The semiconductor device according to claim 1 ,
wherein the channel formation region comprises crystal portions,
wherein c-axes of the crystal portions are aligned in a direction parallel to a normal vector of a surface where the oxide semiconductor film is formed, and
wherein a direction of an a-axis of one of crystal portions is different from a direction of an a-axis of another of crystal portion.
7. The semiconductor device according to claim 1 , wherein the oxide semiconductor film comprises In, Sn, and Zn.
8. A semiconductor device comprising:
an oxide film;
an oxide semiconductor film over the oxide film, the oxide semiconductor film comprising a channel formation region and a first region having a resistance lower than the channel formation region;
a gate insulating film over and in contact with the oxide semiconductor film;
a first insulating film over and in contact with the first region, the first insulating film comprising an oxide of a metal element;
a gate electrode over and in contact with the gate insulating film, the gate electrode overlapping with the channel formation region, and
a second insulating film over and in contact with the gate electrode and the first insulating film,
wherein an entire top surface of the first insulating film is lower than a bottom surface of the gate electrode,
wherein the first region comprises the metal element, and
wherein the oxide film is capable of supplying oxygen to the oxide semiconductor film, and
wherein an entire end portion of the first region is covered with the first insulating film.
9. The semiconductor device according to claim 8 , wherein the oxide semiconductor film comprises In, Ga, and Zn.
10. The semiconductor device according to claim 8 , wherein the gate electrode is in contact with the gate insulating film.
11. The semiconductor device according to claim 8 , further comprising:
a sidewall insulating film over the gate insulating film and on a side surface of the gate electrode;
a third insulating film over the second insulating film; and
an electrode electrically connected to the first region,
wherein the second insulating film is over and in contact with the sidewall insulating film.
12. The semiconductor device according to claim 11 , wherein the electrode is one of a source electrode and a drain electrode.
13. The semiconductor device according to claim 11 , wherein the oxide semiconductor film comprises an impurity region between the channel formation region and the first region, the impurity region having a resistance different from a resistance of the first region.
14. The semiconductor device according to claim 8 , further comprising:
a sidewall insulating film over the first insulating film and on a side surface of the gate electrode;
a third insulating film over the second insulating film; and
an electrode electrically connected to the first region,
wherein the second insulating film is over and in contact with the sidewall insulating film.
15. The semiconductor device according to claim 8 , further comprising:
an electrode over the oxide film, wherein the oxide semiconductor film is over the oxide film and the electrode;
a sidewall insulating film over the gate insulating film and on a side surface of the gate electrode; and
a third insulating film over the second insulating film,
wherein the second insulating film is over and in contact with the sidewall insulating film.
16. The semiconductor device according to claim 15 , wherein the oxide semiconductor film comprises an impurity region between the channel formation region and the first region, the impurity region having a resistance different from a resistance of the first region.
17. The semiconductor device according to claim 8 , further comprising:
an electrode over the oxide film, wherein the oxide semiconductor film is over the oxide film and the electrode;
a sidewall insulating film over the first insulating film and on a side surface of the gate electrode; and
a third insulating film over the second insulating film.
18. The semiconductor device according to claim 8 , wherein the first insulating film comprises one or more elements selected from aluminum, indium, titanium, tin, tungsten, nickel, molybdenum, and zinc.
19. The semiconductor device according to claim 8 ,
wherein the oxide semiconductor film comprises a second region,
wherein the channel formation region is interposed between the first region and the second region, and
wherein each of the first region and the second region comprises one or more elements selected from aluminum, indium, titanium, tin, tungsten, nickel, molybdenum, zinc, phosphorus, arsenic, antimony, boron, nitrogen, helium, neon, argon, fluorine, and chlorine.
20. The semiconductor device according to claim 8 , wherein the oxide semiconductor film comprises an oxide comprising one or more elements selected from indium, zinc, gallium, tin, hafnium, zirconium, titanium, scandium, yttrium, cerium, neodymium, and gadolinium.
21. The semiconductor device according to claim 8 ,
wherein the channel formation region comprises crystal portions,
wherein c-axes of the crystal portions are aligned in a direction parallel to a normal vector of a surface where the oxide semiconductor film is formed, and
wherein a direction of an a-axis of one of crystal portions is different from a direction of an a-axis of another of crystal portion.
22. The semiconductor device according to claim 8 , wherein the oxide semiconductor film comprises In, Sn, and Zn.