IP Library Granted Patent US 9,207,665
Granted Patent B2
US 9,207,665 · App. 13/742,603 · Granted Dec 8, 2015

Heat treatment apparatus and method of controlling the same

Inventors: Goro Takahashi (Oshu, JP); Takahito Kasai (Oshu, JP); Takanori Saito (Oshu, JP); Wenling Wang (Oshu, JP); Koji Yoshii (Oshu, JP); Tatsuya Yamaguchi (Sapporo, JP)
Assignee: TOKYO ELECTRON LIMITED
G05B19/418H01L21/67109H01L21/67115H01L21/67248
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,207,665
App. No.
13/742,603
Granted
Dec 8, 2015
Kind
B2
Abstract

The heat treatment apparatus that increases a temperature of a processing object and performs a heat treatment in a constant temperature, the heat treatment apparatus includes: a processing chamber which accommodates the processing object; a heating unit which heats the processing object accommodated in the processing chamber; a memory unit which stores two or more temperature control models that are previously created, a temperature controller which controls a temperature of the heating unit; and an apparatus controller which controls the temperature controller and the memory unit, wherein the apparatus controller selects a temperature control model among the two or more temperature control models according to desired heat treatment conditions, and wherein the temperature controller reads out the selected temperature control model from the memory unit to control the heating unit.

Claims (24)

1. A heat treatment apparatus that increases or decreases a temperature of a processing object to a setting temperature, the heat treatment apparatus comprising:

a processing chamber which accommodates the processing object;

a heating unit which heats the processing object accommodated in the processing chamber;

a memory unit which stores two or more temperature control models that are previously created;

a temperature controller which controls a temperature of the heating unit; and

an apparatus controller which controls the temperature controller and the memory unit,

wherein the apparatus controller is configured: to select, among the stored two or more temperature control models, a first temperature control model capable of increasing or decreasing the temperature of the processing object more rapidly than other stored temperature control models, and, in the middle of temperature increase or temperature decrease of the processing object, to switch the selected temperature control model to a second temperature control model among the stored two or more temperature control models, the second temperature control model being capable of more stably converging the temperature of the processing object to the setting temperature than other stored temperature control models, and

wherein the temperature controller reads out the selected temperature control model from the memory unit to control the heating unit.

2. A heat treatment apparatus that increases or decreases a temperature of a processing object or performs a heat treatment in a constant temperature, the heat treatment apparatus comprising:

a processing chamber which accommodates the processing object;

a heating unit which heats the processing object accommodated in the processing chamber;

a memory unit which stores two or more temperature control models that are previously created;

a temperature controller which controls a temperature of the heating unit; and

an apparatus controller which controls the temperature controller and the memory unit,

wherein the apparatus controller is configured to select the temperature control model among the two or more temperature control models according to a thickness of a film accumulated on an inner wall surface of the processing chamber.

3. A method of controlling a heat treatment apparatus that comprises a processing chamber which accommodates the processing object; a heating unit which heats the processing object; a memory unit which stores two or more temperature control models that are previously created; a temperature controller which controls a temperature of the heating unit by reading out the temperature control model stored in the memory unit; and an apparatus controller which controls the temperature controller and the memory unit, to increase or decrease a temperature of the processing object to a setting temperature, the method comprising:

selecting, among the stored two or more temperature control models, a first temperature control model capable of increasing or decreasing the temperature of the processing object more rapidly than other stored temperature control models;

controlling the heating unit by reading out the first temperature control model from the memory unit;

in the middle of temperature increase or temperature decrease of the processing object, switching the first temperature control model to a second temperature control model among the stored two or more temperature control models, the second temperature control model being capable of more stably converging the temperature of the processing object to the setting temperature than other stored temperature control models; and

controlling the heating unit by reading out the second temperature control model from the memory unit.

4. A method of controlling a heat treatment apparatus that comprises a processing chamber which accommodates the processing object; a heating unit which heats the processing object; a memory unit which stores two or more temperature control models that are previously created; a temperature controller which controls a temperature of the heating unit by reading out the temperature control model stored in the memory unit; and an apparatus controller which controls the temperature controller and the memory unit, the method comprising:

selecting the temperature control model among the two or more temperature control models according to desired heat treatment conditions; and

controlling the heating unit by reading out the selected temperature control model from the memory unit,

wherein the selecting of the temperature control model comprises selecting the temperature control model among the two or more temperature control models according to a thickness of a film accumulated on an inner wall surface of the processing chamber.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2013
From: TAKAHASHI, GORO; KASAI, TAKAHITO; SAITO, TAKANORI; WANG, WENLING; YOSHII, KOJI; YAMAGUCHI, TATSUYA
To: TOKYO ELECTRON LIMITED
Reel/Frame 029667/0618 →
Priority Claims (1)
JP 2012-020811 · Feb 2, 2012 · national
Continuity (1)
Related Publication 20130204416A1 · Aug 8, 2013