Microelectronic package with self-heating interconnect

1. A microelectronic package, comprising:

a substrate having a plurality of solder bumps disposed on a top side of the substrate;

a die disposed adjacent to the top side of the substrate, wherein the die comprises a plurality of glassy metal bumps disposed on a bottom side of the die; and

an insulating layer disposed between adjacent glassy metal bumps;

wherein the plurality of glassy metal bumps are to melt the plurality of solder bumps to form a liquid solder layer, wherein the liquid solder layer is to attach the die with the substrate.

2. The microelectronic package of claim 1 , wherein the plurality of glassy metal bumps are to generate heat through exothermic crystallization to melt the plurality of solder bumps.

3. The microelectronic package of claim 1 , wherein the die is attached to the substrate at a temperature greater than a glass transition temperature of the plurality of glassy metal bumps.

4. The microelectronic package of claim 1 , further comprising a wettable metal disposed on each of the plurality of glassy metal bumps.

5. The microelectronic package of claim 4 , wherein the wettable metal comprises copper.

6. The microelectronic package of claim 4 , wherein the wettable metal comprises nickel.

7. The microelectronic package of claim 1 , wherein each of the plurality of glassy metal bumps has a glass transition temperature of less than about 200° C.

8. The microelectronic package of claim 1 , wherein each of the plurality of glassy metal bumps comprises Au 49.2 Cu 27 Ag 5.5 Pd 2.35 Si 16 .

9. The microelectronic package of claim 1 , wherein each of the plurality of glassy metal bumps comprises Mg 54 Cu 28 Ag 7 Y 11 .

10. The microelectronic package of claim 1 , wherein each of the plurality of glassy metal bumps comprises La 57.6 Al 17.5 Cu 12.45 Ni 12.45 .

11. A microelectronic package, comprising:

a substrate;

a plurality of composite solder bumps disposed on a top surface of the substrate, wherein each of the plurality of composite solder bumps comprises:

a glassy metal layer; and

a solder layer electroplated on the glassy metal layer; and

a die disposed adjacent to the top surface of the substrate, wherein each of the plurality of composite solder bumps is to generate heat through exothermic crystallization of the glassy metal sphere to melt the solder layer and to attach the die with the substrate.

12. The microelectronic package of claim 11 , wherein the die is attached to the substrate at a temperature greater than a glass transition temperature of the glassy metal layer.

13. The microelectronic package of claim 12 , wherein the glassy metal layer comprises Au 49.2 Cu 27 Ag 5.5 Pd 2.35 Si 16 and the glass transition temperature is about 128° C.