Materials, components, and methods for use with extreme ultraviolet radiation in lithography and other applications
View Patent ↗Nanostructured photonic materials and associated components for use in devices and systems operating at ultraviolet (UV), extreme ultraviolet (EUV), and/or soft Xray wavelengths are described. Such a material may be fabricated with nanoscale features tailored for a selected wavelength range, such as at particular UV, EUV, or soft Xray wavelengths or wavelength ranges. Such a material may be used to make components such as mirrors, lenses or other optics, panels, lightsources, masks, photoresists, or other components for use in applications such as lithography, wafer patterning, biomedical applications, or other applications.
1. An element configured to be used in a light exposure system, wherein the system or subsystem comprises a light source configured to transmit light having a wavelength, the element comprising:
a reflective coating comprising a material having a plurality of internal voids interspersed within the material, the internal voids each having a size of between 250 nm and 0.01 nm;
wherein the internal voids are configured to improve the reflectivity of the element to greater than 70% for incident light for a wavelength between 0.1 nm and 250 nm.
2. An element configured to be used in a light exposure system, wherein the system or subsystem comprises a light source configured to transmit light having a wavelength, the element comprising:
a coating comprising a material having a plurality of internal voids interspersed within the material, the internal voids each having a size of between 250 nm and 0.01 nm,
wherein the internal voids are configured to improve the transmission of the element to greater than 4% through the material for a wavelength between 0.1 nm and 250 nm.
3. An element configured to be used in a light exposure system, wherein the system or subsystem comprises a light source configured to transmit light having a wavelength, the element comprising:
a coating comprising a material having a plurality of internal voids interspersed within the material, the internal voids each having a size of between 250 nm and 0.01 nm;
wherein the internal voids are configured to control the electromagnetic radiation absorption for a wavelength between 0.1 nm and 250 nm, wherein the internal voids are configured to reduce or increase the bulk electromagnetic absorption of the material.
4. The light exposure system according to claim 1 , 2 or 3 where the system includes a photolithography tool, biotechnology system, scanning or imaging system, astronomical system, material processing system or a printing system.
5. The element according to claim 1 , wherein the size substantially correlates with the wavelength.
6. The element according to claim 1 , 2 or 3 , wherein the material or internal voids are one dimensional, two dimensional or three dimensional.
7. The element according to claim 1 , wherein the material or internal voids have a periodicity in the material, said periodicity in one, two, or three dimensions.
8. The element according to claim 1 , 2 or 3 , wherein the material or internal voids are arranged in one of the following: semi-periodic, aperiodic, quasi-periodic, graded, partially graded, symmetric, fractal, gyroid, swiss roll, non-planar, segments, repeated unit, forming a pattern, or randomly or semi random order in the material.
9. The element according to claim 1 , 2 or 3 , wherein the material or the internal voids comprises one or more of the following: metal, dielectric, gas, liquid, compound, semiconductor, polymer, organic material, biological material, monatomic material, air, Carbon, Molybdenum, Beryllium, Lanthanum, Boron Carbide, Silicon, SiO2, TiO2, Ruthenium, Niobium, Rhodium, Gold, Silver, Copper, Platinum, Palladium, Germanium, DNA, proteins, graphene, graphite, carbon nanotubes, MoS, O2, N2, He, H2, Ar, CO2.
10. The element according to claim 1 , wherein the element comprises a substrate, mirror, lens, surface, window, facet, filter, covering element, capping layer, protective layer, barrier layer, thin film, coating, internal surface area, collector, droplet generator, interdispersed material, panel, waveguide, cavity, fiber, structural component, reflective element, transmissive element, a detector, a wavelength monitor, bandwidth or power monitor, sensors, a photomask, photoresist, a cooling mechanism, a heat management mechanism, light source, lamp, laser, optical element, mask aligner, integrator, structural component, optical device, or an electrical device.
11. The element according to claim 1 , wherein the material or internal voids have shapes or dimensions containing layers, films, spheres, blocks, pyramids, rings, porous structures, cylinders, linked shapes, shells, freeform shapes, chiral structures, hemispheres or segments.
12. The element according to claim 1 , wherein the material is cleaned or post processed or smoothed by one of the following methods of processing: chemical etching, laser radiation or heating.
13. The element according to claim 1 , wherein the material or subset of the material or aspect of the material is fabricated by one of the following methods of processing: self-assembly, directed assembly, soft templating, electroforming, electroplating, sacrificial or scaffolding materials, block co-polymers, bottom-up techniques, EUV or XUV lithography, focused electron or ion beams, nanoimprinting, atomic force or scanning probe microscopy, two or more photon lithography, laser irradiation, dealloying, chemical etching, chemical surfactants, surface treatments.