IP Library Granted Patent US 9,184,160
Granted Patent B2
US 9,184,160 · App. 13/748,978 · Granted Nov 10, 2015

Semiconductor device and method for manufacturing the same

Inventor: Shunpei Yamazaki (Tokyo, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L27/0629H01L27/1225H01L27/1255H01L29/66969H01L27/1156
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Quick Facts
Patent No.
US 9,184,160
App. No.
13/748,978
Granted
Nov 10, 2015
Kind
B2
Abstract

A semiconductor device having high electric characteristics and in which a capacitor is efficiently formed even if the semiconductor device has a miniaturized structure. In a top-gate (also referred to as staggered) transistor using an oxide semiconductor film as its active layer, a source electrode and a drain electrode has a two-layer structure (a first electrode film and a second electrode film). Then, a capacitor is formed using a film formed using a material and a step similar to those of the first electrode film, a gate insulating film, and a gate electrode. Accordingly, the transistor and the capacitor can be formed through the same process efficiently. Further, the second electrode is connected onto the oxide semiconductor film between a first electrode and a channel formation region of the transistor. Accordingly, resistance between source and drain electrodes can be reduced; therefore, electric characteristics of the semiconductor device can be improved.

Claims (32)

1. A semiconductor device comprising a transistor and a capacitor, the transistor comprising:

an oxide semiconductor film over an insulating surface;

a gate insulating film over the oxide semiconductor film;

a gate electrode over the gate insulating film;

a first electrode film covering an end portion of the oxide semiconductor film, and in direct contact with the end portion of the oxide semiconductor film; and

a second electrode film over and in direct contact with the first electrode film, wherein a portion of the second electrode film is in direct contact with a top surface of the oxide semiconductor film,

the capacitor comprising:

a lower electrode film;

an insulating film over the lower electrode film; and

an upper electrode film over the insulating film.

2. The semiconductor device according to claim 1 , further comprising a second transistor under the transistor,

wherein an active layer of the second transistor comprises silicon, germanium, or a compound semiconductor material, and

wherein the second transistor is electrically connected to at least the transistor or the capacitor.

3. The semiconductor device according to claim 2 , wherein the active layer of the second transistor comprises a film obtained using separation of part of a single crystal semiconductor substrate or a compound semiconductor substrate.

4. The semiconductor device according to claim 2 , wherein the second transistor is positioned over a flexible substrate, and wherein the transistor is positioned over the second transistor.

5. The semiconductor device according to claim 1 , wherein the oxide semiconductor film includes indium, gallium and zinc.

6. The semiconductor device according to claim 1 , wherein the first electrode film and the lower electrode film are over and in direct contact with the insulating surface.

7. The semiconductor device according to claim 1 , wherein the insulating film is same as the gate insulating film, and the upper electrode film is same as the gate electrode.

8. The semiconductor device according to claim 1 , wherein the semiconductor device is one selected from the group consisting of a portable personal computer, an e-book reader, a smartphone, a digital video camera and a television set.

9. A semiconductor device comprising a transistor, the transistor comprising:

an oxide semiconductor film over an insulating surface;

a gate insulating film over the oxide semiconductor film;

a gate electrode over the gate insulating film;

a first electrode film covering an end portion of the oxide semiconductor film and in direct contact with the end portion of the oxide semiconductor film; and

a second electrode film over and in direct contact with the first electrode film, wherein a portion of the second electrode film is in direct contact with a top surface of the oxide semiconductor film.

10. The semiconductor device according to claim 9 , further comprising a second transistor under the transistor,

wherein an active layer of the second transistor comprises silicon, germanium, or a compound semiconductor material, and

wherein the second transistor is electrically connected to the transistor.

11. The semiconductor device according to claim 10 , wherein the active layer of the second transistor comprises a film obtained using separation of part of a single crystal semiconductor substrate or a compound semiconductor substrate.

12. The semiconductor device according to claim 10 , wherein the second transistor is positioned over a flexible substrate, and wherein the transistor is positioned over the second transistor.

13. The semiconductor device according to claim 9 , wherein the oxide semiconductor film includes indium, gallium and zinc.

14. The semiconductor device according to claim 9 , wherein the semiconductor device is one selected from the group consisting of a portable personal computer, an e-book reader, a smartphone, a digital video camera and a television set.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2013
From: YAMAZAKI, SHUNPEI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 029803/0673 →
Priority Claims (1)
JP 2012-013985 · Jan 26, 2012 · national
Continuity (1)
Related Publication 20130193433A1 · Aug 1, 2013