Methods For Analysis Of Water And Substrates Rinsed In Water
A method is disclosed for determining metal content in a container of water. The method includes contacting a substrate with the water for a predetermined period of time. The substrate is then dried and analyzed to determine the metal content of the substrate surface. A determination is then made of the metal content in the water from the metal content on the substrate surface.
1 . A method for determining metal content in a container of water, the method comprising;
contacting a substrate with the water for a predetermined period of time, the substrate having a surface;
drying the substrate;
analyzing the substrate surface to determine metal content; and
determining the metal content in the water from the metal content on the substrate surfaces.
2 . The method of claim 1 wherein the predetermined period of time is at least 500 minutes.
3 . The method of claim 1 wherein the predetermined period of time is at least 700 minutes.
4 . The method of claim 1 wherein the predetermined period of time is 750 minutes.
5 . The method of claim 1 wherein the metal content includes nickel.
6 . The method of claim 1 wherein contacting the substrate with the water comprises immersing the substrate in water.
7 . The method of claim 1 wherein contacting the substrate with the water comprises directing a flow of water to contact the substrate surface.
8 . The method of claim 1 wherein the substrate is a semiconductor wafer.
9 . The method of claim 1 further comprising analyzing the substrate surface to determine metal content on the substrate surface prior to contacting the substrate with the water.
10 . The method of claim 1 further comprising placing the substrate in the container while the water is present in the container.
11 . The method of claim 10 wherein the substrate is oriented substantially parallel to a vertical sidewall of the container.
12 . The method of claim 10 wherein the substrate is oriented substantially perpendicular to a vertical sidewall of the container.
13 . The method of claim 10 wherein placing the substrate in the container comprises placing the substrate in a support member.
14 . The method of claim 13 wherein placing the substrate in a support member comprises placing the substrate in the support member using one of a vacuum wand and a robotic effector.
15 . The method of claim 13 wherein the support member is formed from a material that does not release contaminants when in the presence of the water.
16 . The method of claim 13 wherein the support member is coated with a layer of material that is non-reactive with the water.
17 . The method of claim 10 further comprising cleaning the container prior to placing the substrate in the container.
18 . The method of claim 17 wherein cleaning the container comprises washing the container with acid.