Near-field exposure mask and pattern forming method
A near-field exposure mask according to an embodiment includes: a substrate; a concave-convex structure having convexities and concavities and formed on one surface of the substrate; a near-field light generating film arranged at least on a tip portion of each of the convexities, the near-field light generating film being a layer containing at least one element selected from the group consisting of Au, Al, Ag, Cu, Cr, Sb, W, Ni, In, Ge, Sn, Pb, Zn, Pd, and C, or a film stack formed with layers made of some of those materials; and a resin filled in each of the concavities.
1. A near-field exposure mask comprising:
a substrate;
a concave-convex structure comprising convexities and concavities formed on one surface of the substrate;
a near-field light generating film arranged at least on a tip portion of each of the convexities, the near-field light generating film being a layer comprising at least one element selected from the group consisting of Au, Al, Ag, Cu, Cr, Sb, W, Ni, In, Ge, Sn, Pb, Zn, Pd, and C, or a film stack formed with layers made of some of those materials; and
a resin filled in each of the concavities.
2. The mask according to claim 1 , wherein the convexities are formed of the near-field light generating film.
3. The mask according to claim 2 , wherein a height of at least one of the convexities formed of the near-field light generating film is 50 nm or less.
4. The mask according to claim 3 , wherein the near-field light generating film is a layer comprising at least one element selected from the group consisting of Au, Al, Ag, Cu, Cr, Sb, W, Ni, In, Ge, Sn, Pb, Zn, Pd, and C.
5. The mask according to claim 2 , wherein the near-field light generating film is a layer comprising at least one element selected from the group consisting of Au, Al, Ag, Cu, Cr, Sb, W, Ni, In, Ge, Sn, Pb, Zn, Pd, and C.
6. The mask according to claim 1 , wherein the convexities are formed of the substrate, and the near-field light generating film covers a top surface of each of the convexities, and at least part of sides connecting to the top surface of each of the convexities.
7. The mask according to claim 6 , wherein the near-field light generating film is a layer comprising at least one element selected from the group consisting of Au, Al, Ag, Cu, Cr, Sb, W, Ni, In, Ge, Sn, Pb, Zn, Pd, and C.
8. The mask according to claim 1 , wherein the substrate is a transparent substrate.
9. The mask according to claim 8 , wherein the near-field light generating film is a layer comprising at least one element selected from the group consisting of Au, Al, Ag, Cu, Cr, Sb, W, Ni, In, Ge, Sn, Pb, Zn, Pd, and C.
10. The mask according to claim 1 , wherein the resin filled in each of the concavities is a silicon resin or epoxy resin.
11. The mask according to claim 10 , wherein the near-field light generating film is a layer comprising at least one element selected from the group consisting of Au, Al, Ag, Cu, Cr, Sb, W, Ni, In, Ge, Sn, Pb, Zn, Pd, and C.
12. The mask according to claim 1 , wherein the near-field light generating film is a layer comprising at least one element selected from the group consisting of Au, Al, Ag, Cu, Cr, Sb, W, Ni, In, Ge, Sn, Pb, Zn, Pd, and C.
13. A pattern forming method for forming a pattern using a near-field exposure mask including:
a first substrate;
a concave-convex structure comprising convexities and concavities formed on one surface of the first substrate; and
a near-field light generating film arranged at least on a tip portion of each of the convexities, the near-field light generating film being a layer comprising at least one element selected from the group consisting of Au, Al, Ag, Cu, Cr, Sb, W, Ni, In, Ge, Sn, Pb, Zn, Pd, and C, or a film stack formed with layers made of some of those materials,
the method comprising:
applying a light-curable resin onto a second substrate;
positioning the near-field exposure mask so that the near-field light generating film arranged to the tip portion of each of the convexities is in contact with a surface of the light-curable resin applied onto the second substrate;
emitting light from either a side of the first substrate or a side of the second substrate; and
detaching the near-field exposure mask from the second substrate.
14. The method according to claim 13 , wherein in the near-field exposure mask, a resin is filled in each of the concavities of the concave-convex structure.
15. The method according to claim 13 , wherein the convexities of the near-field exposure mask are formed of the near-field light generating film.
16. The method according to claim 13 , wherein the convexities of the near-field exposure mask are formed of the first substrate, and the near-field light generating film covers a top surface of each of the convexities and at least part of sides connecting to the top surface of each of the convexities.
17. The method according to claim 13 , wherein the first substrate is a transparent substrate, and light is emitted from a side of the first substrate.