Through-vias and methods of forming the same
An integrated circuit structure includes a substrate, a metal ring penetrating through the substrate, a dielectric region encircled by the metal ring, and a through-via penetrating through the dielectric region. The dielectric region is in contact with the through-via and the metal ring.
1. An integrated circuit structure comprising:
a substrate comprising a front surface and a back surface;
a ring penetrating through the substrate;
an active region at the front surface of the substrate;
a dielectric region encircled by the ring, wherein the ring, the dielectric region, and the substrate comprise different materials; and
a through-via penetrating through the dielectric region, with the dielectric region contacting the through-via and the rin wherein the dielectric region is wider at the back surface of the substrate than at the front surface of the substrate.
2. The integrated circuit structure of claim 1 , wherein the dielectric region comprises a polymer.
3. The integrated circuit structure of claim 1 further comprising an additional through-via penetrating through the dielectric region, wherein a first portion of the dielectric region encircling the through-via is continuously connected to a second portion of the dielectric region encircling the additional through-via.
4. The integrated circuit structure of claim 1 , wherein the ring comprises a metal ring.
5. The integrated circuit structure of claim 4 , wherein the metal ring is electrically grounded.
6. The integrated circuit structure of claim 1 , wherein the ring comprises an isolation ring formed of a dielectric material.
7. The integrated circuit structure of claim 1 , wherein the dielectric region has a thickness greater than a thickness of the substrate.
8. The integrated circuit structure of claim 1 further comprising a plurality of additional through-vias penetrating through the substrate, wherein portions of the substrate are located between the plurality of additional through-vias.
9. An integrated circuit structure comprising:
a semiconductor substrate comprising a front surface and a back surface;
an active device at the front surface of the semiconductor substrate;
a polymer region penetrating through the semiconductor substrate;
a dielectric region extending from the front surface to the back surface of the semiconductor substrate, wherein the dielectric region is wider at the back surface of the semiconductor substrate than at the front surface of the semiconductor substrate; and
a first through-via penetrating through the polymer region.
10. The integrated circuit structure of claim 9 further comprising a second through-via penetrating through the polymer region, wherein the first through-via and the second through-via are in contact with the polymer region, and wherein a first portion of the polymer region in contact with the first through-via is continuously connected to a second portion of the polymer region in contact with the second through-via.
11. The integrated circuit structure of claim 9 , wherein the polymer region comprises:
a top surface level with or higher than the front surface of the semiconductor substrate; and
a bottom surface level with or lower than the back surface of the semiconductor substrate.
12. The integrated circuit structure of claim 9 further comprising a metal ring encircling the polymer region, and wherein the metal ring is electrically grounded.
13. The integrated circuit structure of claim 9 further comprising an isolation ring encircling the polymer region.
14. An integrated circuit structure comprising:
a semiconductor substrate comprising a front surface and a back surface opposite to the front surface;
an active device disposed at the front surface of the semiconductor substrate;
a dielectric region extending from the front surface to the back surface of the semiconductor substrate, wherein the dielectric region is wider on a backside of the semiconductor substrate than on a front side of the semiconductor substrate;
a plurality of through-vias encircled, and separated from each other, by the dielectric region, wherein the plurality of through-vias extends from a front surface of the dielectric region to a back surface of the dielectric region;
a first conductive feature on a front side of the semiconductor substrate; and
a second conductive feature on a backside of the semiconductor substrate, wherein the first conductive feature is electrically coupled to the second conductive feature through one of the plurality of through-vias.
15. The integrated circuit structure of claim 14 further comprising:
a first dielectric layer on the front side of the semiconductor substrate; and
a second dielectric layer on the backside of the semiconductor substrate, wherein the plurality of through-vias further extends into the first dielectric layer and the second dielectric layer.
16. The integrated circuit structure of claim 15 , wherein the first dielectric layer comprises an Inter-Layer Dielectric.
17. The integrated circuit structure of claim 15 further comprising an additional conductive feature at a level between a level of the second conductive feature and a back surface of the dielectric region.
18. The integrated circuit structure of claim 14 , wherein the dielectric region comprises a polymer.
19. The integrated circuit structure of claim 14 further comprises a metallic ring in the semiconductor substrate, wherein the metallic ring encircles, and is in contact with, the dielectric region.