Semiconductor package
Semiconductor packages are disclosed. A semiconductor package includes: a first chip that includes a chip region and scribe regions at edges of the chip region, wherein the chip region comprises integrated circuit units and main through substrate vias electrically connected to the integrated circuit units; and a second chip that is bonded onto the first chip. The semiconductor package includes dummy conductive connectors including at least dummy wiring lines, the dummy conductive connectors electrically connected to the main through substrate vias at one end, and not capable of forming an electrical connection at the other end.
1. A semiconductor package comprising:
a first chip that includes a chip region and scribe regions at edges of the chip region, wherein the chip region comprises integrated circuit units and main through substrate vias electrically connected to the integrated circuit units; and
a second chip that is bonded onto the first chip,
wherein the semiconductor package includes dummy conductive connectors including at least dummy wiring lines, the dummy conductive connectors electrically connected to the main through substrate vias at one end, and arranged to prevent an electrical connection at the other end.
2. The semiconductor package of claim 1 , wherein the dummy wiring lines extend from the chip region of the first chip to the scribe regions.
3. The semiconductor package of claim 1 , wherein the dummy wiring lines are surrounded by an intermetallic insulating layer in the first chip.
4. The semiconductor package of claim 1 , wherein the first chip and the second chip are electrically connected through the main through substrate vias.
5. The semiconductor package of claim 1 , wherein the dummy wiring lines terminate at side surfaces of the first chip.
6. The semiconductor package of claim 1 , wherein the dummy conductive connectors further comprise dummy through substrate vias formed in the scribe regions of the first chip.
7. The semiconductor package of claim 6 , wherein each dummy through substrate via is electrically connected to a main through substrate via through one of the dummy wiring lines.
8. The semiconductor package of claim 6 , further comprising test pads that are formed in the scribe regions in the first chip and are electrically connected to the dummy through substrate vias.
9. The semiconductor package of claim 8 , further comprising a molding member that covers the test pads and side surfaces of the second chip.
10. The semiconductor package of claim 8 , wherein prior to the formation of the molding member, the test pads are configured to perform an electrical die sorting (EDS) test for detecting whether the connection between the second chip and the main through substrate vias is favorable or not.
11. A semiconductor package comprising:
a first chip that comprises through substrate vias connected to circuitry in the first chip, and first connection members that are electrically connected to the through substrate vias;
a second chip that is stacked on the first chip and comprises second connection members that are electrically connected to the through substrate vias; and
a sealing member that seals side surfaces of the first and second chip not to be exposed,
wherein the first chip comprises dummy wiring lines that terminate at the side surfaces of the first chip and are electrically connected to the through substrate vias.
12. The semiconductor package of claim 11 , wherein the first chip comprises:
a substrate having a first surface and a second surface;
a plurality of integrated circuit units on the first surface of the substrate;
an insulating interlayer that covers the integrated circuit units;
a plurality of multi-layer wiring patterns that are formed on the insulating interlayer and are connected to the main through substrate vias; and
a lower insulating layer that covers the multi-layer wiring patterns,
wherein the first connection members are formed on the lower insulating layer and are electrically connected to the multi-layer wiring patterns, and
the dummy wiring lines are formed on the insulating interlayer.
13. A semiconductor package, comprising:
a first chip including through substrate vias electrically connected to circuitry within the first chip;
first external connection terminals electrically connected to the through substrate vias, respectively;
a second chip stacked on the first chip, the second chip including connection terminals electrically connected to the through substrate vias of the first chip; and
a dummy conductive connector including at least a dummy wiring line, the dummy conductive connector including a first end electrically connected to the circuitry within the first chip and a second end left floating.
14. The semiconductor package of claim 13 , further comprising an insulative capping layer that covers and contacts the dummy conductive connector.
15. The semiconductor package of claim 13 , wherein the dummy conductive connector includes only the dummy wiring line.
16. The semiconductor package of claim 13 , wherein the dummy wiring line terminates at the same plane as a first side of the first chip.
17. The semiconductor package of claim 13 , wherein the dummy wiring line connects to an insulative capping layer.
18. The semiconductor package of claim 13 , wherein the dummy conductive connector includes the dummy wiring line and at least a through substrate via electrically connected to the dummy wiring line.
19. The semiconductor package of claim 18 , wherein the through substrate via is located in a scribe region of the first chip.
20. The semiconductor package of claim 18 , wherein the dummy conductive connector further includes a dummy pad disposed on the through substrate via, the dummy pad contacting an insulative capping layer disposed around the second chip.