Method and apparatus for applying polish to nails
A device for applying decoration to a nail. The device includes an elongated member having a first end having a mounting feature thereon, the mounting feature configured to maintain the first end of the device in a fixed position, and a generally opposite, free-floating end configured to be coupled to a nail decoration, the free-floating end configured to provide controlled movement of the decoration. The elongated member is configured to inhibit unintentional movement thereof.
1. A method for applying polish to a nail, the method comprising the acts of:
providing a device comprising an elongated member having a first end with a mounting feature thereon and a generally opposite, free-floating end, the mounting feature configured to maintain a first end of the device in a fixed position, the free-floating end configured to provide controlled movement of the nail polish brush;
coupling the mounting feature to an end of a structure;
coupling a nail polish brush to an end of the free-floating end of the device;
manually and intentionally moving at least the end of the free-floating end of the device to apply polish to the nail; and
allowing intentional manual movement and absorbing unintentional manual movement of at least the end of the free-floating end of the device.
2. The method of claim 1 , wherein the device has an inertial mass sufficient to absorb the unintentional movement of at least the end of the free-floating end of the device.
3. The method of claim 1 , wherein the unintentional manual movement is associated with a natural unsteadiness of a user's hand.
4. The method of claim 1 , wherein the free-floating end is pivotable and rotatable.
5. The method of claim 1 , wherein the free-floating end further comprises a plurality of segments pivotally coupled to one another.
6. The method of claim 1 , wherein the mounting feature includes a clamp, a suction device, adhesive, a weight, a weighted portion, or a combination thereof.