SOLID-STATE IMAGE PICKUP APPARATUS AND ELECTRONIC APPARATUS
A solid-state image pickup apparatus includes a pixel region in which a plurality of pixels each including a photoelectric conversion element are arranged, transfer wirings formed on the pixel region in parallel to each other with uniform opening widths, and different wirings formed in a wiring layer above the transfer wirings. At least a part of the different wirings is overlapped with the transfer wirings on a plan position. The transfer wirings and the different wirings form a light shielding structure in the pixel region.
1 . A solid-state image pickup apparatus, comprising:
a pixel region in which a plurality of pixels each including a photoelectric conversion element are arranged;
transfer wirings formed on the pixel region in parallel to each other with uniform opening widths; and
different wirings formed in a wiring layer above the transfer wirings, at least a part of the different wirings being overlapped with the transfer wirings on a plan position, the transfer wirings and the different wirings forming a light shielding structure in the pixel region.
2 . The solid-state image pickup apparatus according to claim 1 , wherein
the photoelectric conversion element is provided on a first surface of a substrate, and the wiring layer is provided on a second surface of the substrate.
3 . The solid-state image pickup apparatus according to claim 2 , further comprising
a second substrate bonded to the second surface side of the substrate through the wiring layer, wherein
the second substrate includes a peripheral circuit unit, and
the light shielding structure is formed between the pixel region and the peripheral circuit unit.
4 . The solid-state image pickup apparatus according to claim 1 , further comprising
an active element configured to perform signal processing and provided close to the photoelectric conversion element.
5 . The solid-state image pickup apparatus according to claim 4 , wherein
the active element includes at least one of a field-effect transistor and a diode.
6 . The solid-state image pickup apparatus according to claim 1 , wherein
the different wirings include a pulse wiring and a dummy wiring.
7 . An electronic apparatus, comprising:
a solid-state image pickup apparatus including
a pixel region in which a plurality of pixels each including a photoelectric conversion element are arranged,
transfer wirings formed on the pixel region in parallel to each other with uniform opening widths, and
different wirings formed in a wiring layer above the transfer wirings, at least a part of the different wirings being overlapped with the transfer wirings on a plan position, the transfer wirings and the different wirings forming a light shielding structure in the pixel region; and
a signal processing circuit configured to process an output signal of the solid-state image pickup apparatus.