IP Library Granted Patent US 8,758,027
Granted Patent B1
US 8,758,027 · App. 13/769,120 · Granted Jun 24, 2014

Integrated circuit (IC) socket with contoured capture groove

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Quick Facts
Patent No.
US 8,758,027
App. No.
13/769,120
Granted
Jun 24, 2014
Kind
B1
Abstract

An improved test socket for testing or connecting an integrated circuit is disclosed having a platform for receiving the integrated circuit and adapted to overlay a piece of test equipment or other board, the platform formed with an array of slots each locating a portion of a two-piece connector assembly. The socket includes a conforming groove that captures an elastomer member therein while providing exposure of the elastomer member to a link assembly. The socket, with the capture groove, provides improved contact of the link assembly and reliability in locating and maintaining positioning of the elastomer member.

Claims (11)

1. An improved socket for electrically coupling an integrated circuit (IC) to a board so that a signal may be transmitted thereto, comprising:

a platform for receiving the integrated circuit thereon;

an elongate resilient tubular member housed in the platform; and

a plurality of two-piece connector assemblies, each connector assembly comprising a mount and an associated link pivotable about the mount, each connector assembly having first and second positions, the first position comprising an engaged position wherein an electrical contact is established between the integrated circuit and the board, and a standby position where the link does not establish an electrical contact between the integrated circuit and the board;

wherein the mounts are retained in the platform and comprise a curved cavity on a lateral side opposite an associated link member; and

wherein the associated link member has an arcuate contact surface on an upper side adapted for rolling contact with the integrated circuit, a rocker arm laterally displaced with a bulb-shaped tip seated in the curved cavity of the mount, the link vertically pivotable about bulb tip, and a downwardly sloping leg member

wherein the elongate resilient tubular member biases the connector assemblies in the standby position; and

wherein the socket includes a groove for receiving the elongate resilient member, the groove having a profile that substantially coincides with a profile of the elongate resilient member.

2. The socket of claim 1 , wherein the profile of the groove is semi-circular.

3. The socket of claim 2 wherein the profile of the groove includes an arc of greater than one hundred eighty degrees.

4. The socket of claim 2 wherein the profile of the groove includes an arc of at least two hundred and seventy degrees.

Assignments (6)
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS, RECORDED AT REEL 047185, FRAME 0624 Recorded Mar 7, 2024
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS AGENT
To: XCERRA CORPORATION
Reel/Frame 066762/0811 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT STATEMENT THAT THIS DOCUMENT SERVES AS AN OATH/DECLARATION PREVIOUSLY RECORDED ON REEL 047185 FRAME 0628. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT SECURITY AGREEMENT. Recorded Nov 28, 2018
From: XCERRA CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047675/0354 →
PATENT SECURITY AGREEMENT Recorded Oct 2, 2018
From: XCERRA CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047185/0624 →
FIRST SUPPLEMENT TO INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Sep 17, 2015
From: XCERRA CORPORATION; EVERETT CHARLES TECHNOLOGIES LLC
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AGENT
Reel/Frame 036622/0065 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2015
From: TITAN SEMICONDUCTOR TOOL, LLC
To: XCERRA CORPORATION
Reel/Frame 035174/0687 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2013
From: LANDA, VICTOR; TIENGTUM, PONGSAK
To: TITAN SEMICONDUCTOR TOOL, LLC
Reel/Frame 029820/0142 →