SPRING SYSTEM FOR MEMS DEVICE
A spring system ( 74 ) links a pair of drive masses ( 30, 32 ) of a MEMS device ( 72 ). The spring system ( 74 ) includes stiff beams ( 76, 78, 80, 82 ) oriented to form a parallelogram arrangement ( 84 ). The beams are oriented diagonal to a drive direction ( 56 ) of the masses ( 30, 32 ). Diagonally opposing corners ( 86, 88 ) of the parallelogram arrangement ( 84 ) are coupled to the drive masses ( 30, 32 ). A spring ( 90 ) is coupled to a corner ( 94 ) and a spring ( 92 ) is coupled to a diagonally opposing corner ( 96 ) of the parallelogram arrangement. The springs ( 90, 92 ) are interconnected with a sense frame ( 34 ) surrounding the drive masses. The beams and side springs are stiff to substantially prevent in-phase motion ( 66 ) of the drive masses. However, rotationally compliant flexures ( 102, 104, 106, 108 ), allow the arrangement ( 84 ) to collapse and expand to enable anti-phase motion ( 60 ) of the drive masses.
1 . A microelectromechanical systems (MEMS) device comprising:
a first movable mass;
a second movable mass; and
a spring system for coupling said first movable mass to said second movable mass, said spring system comprising:
a set of stiff beams oriented relative to one another to form a parallelogram arrangement, said beams being oriented diagonal to a drive direction of said first and second movable masses, wherein a first corner of said parallelogram arrangement is configured to couple to said first movable mass and a second corner of said parallelogram arrangement is configured to couple to said second movable mass, said second corner being diagonally opposite said first corner;
a first side spring coupled to a third corner of said parallelogram arrangement; and
a second side spring coupled to a fourth corner of said parallelogram arrangement, said fourth corner being diagonally opposite said third corner.
2 . A MEMS device as claimed in claim 1 wherein said spring system further comprises:
a first flexure arrangement interconnecting a first beam and a second beam of said parallelogram arrangement at said first corner;
a second flexure arrangement interconnecting a third beam and a fourth beam of said parallelogram arrangement at said second corner;
a third flexure arrangement interconnecting said first beam and said third beam of said parallelogram arrangement at said third corner; and
a fourth flexure arrangement interconnecting said second beam and said fourth beam of said parallelogram arrangement at said fourth corner, wherein each of said first, second, third, and fourth flexure arrangements is rotationally compliant about an axis that is substantially perpendicular to a planar substrate of said MEMS device.
3 . A MEMS device as claimed in claim 2 wherein said each of said first, second, third, and fourth flexure arrangements is axially stiff to substantially limit rotational movement of said first, second, third, and fourth flexure arrangements to a plane that is substantially parallel to said planar substrate.
4 . A MEMS device as claimed in claim 1 wherein said parallelogram arrangement is configured to collapse when subjected to a drive signal to enable anti-phase motion of said first and second movable masses.
5 . A MEMS device as claimed in claim 1 wherein said parallelogram arrangement is constrained to a non-collapsed configuration when subjected to an external vibration signal.
6 . A MEMS device as claimed in claim 1 wherein said first and second side springs are stiff in said drive direction and compliant in a second direction that is orthogonal to said drive direction.
7 . A MEMS device as claimed in claim 6 wherein said drive direction and said second direction are substantially parallel to a planar substrate of said MEMS device.
8 . A MEMS device as claimed in claim 1 further comprising a frame surrounding said first and second movable masses, wherein opposing ends of each of said first and second side springs are adapted to interconnect with said frame.
9 . A MEMS device as claimed in claim 1 further comprising a planar substrate, wherein said set of stiff beams, said first side spring, and said second side spring are suspended above said planar substrate without a direct connection to said planar substrate.
10 . A method of fabricating a microelectromechanical systems (MEMS) device comprising:
forming a first movable mass, a second movable mass, and a sense frame surrounding said first and second movable masses on a planar substrate;
forming a spring system, said spring system including a set of stiff beams oriented relative to one another to form a parallelogram arrangement, a first side spring, and a second side spring; and
wherein said spring system is coupled to said first and second movable masses such that said beams are oriented diagonal to a drive direction of said first and second movable masses, wherein a first corner of said parallelogram arrangement is coupled to said first movable mass, a second corner of said parallelogram arrangement is coupled to said second movable mass, said second corner being diagonally opposite said first corner, and wherein said first side spring is coupled to a third corner of said parallelogram arrangement, said second side spring is coupled to a fourth corner of said parallelogram arrangement, said fourth corner being diagonally opposite said third corner.
11 . A method as claimed in claim 10 wherein following said forming operations:
a first beam and a second beam of said parallelogram arrangement are interconnected at said first corner via a first flexure arrangement;
a third beam and a fourth beam of said parallelogram arrangement are interconnected at said second corner via a second flexure arrangement;
said first beam and said third beam of said parallelogram arrangement are interconnected at said third corner via a third flexure arrangement; and
said second beam and said fourth beam of said parallelogram arrangement are interconnected at said fourth corner via a fourth flexure arrangement, wherein each of said first, second, third, and fourth flexure arrangements is rotationally compliant about an axis that is substantially perpendicular to a planar substrate of said MEMS device.
12 . A method as claimed in claim 10 wherein following said forming operations, opposing ends of each of said first and second side springs are interconnected to said sense frame.
13 . A method as claimed in claim 10 wherein following said forming operations, said parallelogram arrangement is configured to collapse when subjected to a drive signal to enable anti-phase motion of said first and second movable masses, and said parallelogram arrangement is constrained to a non-collapsed configuration when subjected to an external vibration signal.
14 . A method as claimed in claim 10 wherein said first and second side springs are stiff in said drive direction and compliant in a second direction that is orthogonal to said drive direction, said drive direction and said second direction being substantially parallel to a planar substrate of said MEMS device.
15 . A method as claimed in claim 10 further comprising suspending said parallelogram arrangement, said first side spring, and said second spring above a planar substrate of said MEMS device without a direct connection to said planar substrate.
16 . A microelectromechanical systems (MEMS) device comprising:
a substrate having a planar surface;
a sense frame suspended above and movably anchored to said planar surface, said sense frame having a central opening;
a first drive mass;
a second drive mass, said first and second drive masses being positioned within said central opening of said sense frame; and
a spring system configured to reduce in-phase motion of said first and second movable masses, said spring system including:
a set of stiff beams oriented relative to one another to form a parallelogram arrangement, said beams being oriented diagonal to a drive direction of said first and second movable masses, a first corner of said parallelogram arrangement being coupled to said first movable mass and a second corner of said parallelogram arrangement being coupled to said second movable mass, said second corner being diagonally opposite said first corner;
a first side spring coupled to a third corner of said parallelogram arrangement, and having first opposing ends interconnected with said sense frame; and
a second side spring coupled to a fourth corner of said parallelogram arrangement, and having second opposing ends interconnected with said sense frame, said fourth corner being diagonally opposite said third corner, said first and second side springs being stiff in said drive direction and compliant in a second direction that is orthogonal to said drive direction.
17 . A MEMS device as claimed in claim 16 wherein said spring system further comprises:
a first flexure arrangement interconnecting a first beam and a second beam of said parallelogram arrangement at said first corner;
a second flexure arrangement interconnecting a third beam and a fourth beam of said parallelogram arrangement at said second corner;
a third flexure arrangement interconnecting said first beam and said third beam of said parallelogram arrangement at said third corner; and
a fourth flexure arrangement interconnecting said second beam and said fourth beam of said parallelogram arrangement at said fourth corner, wherein each of said first, second, third, and fourth flexure arrangements is rotationally compliant about an axis that is substantially perpendicular to said planar surface of said substrate.
18 . A MEMS device as claimed in claim 17 wherein said each of said first, second, third, and fourth flexure arrangements is axially stiff to substantially limit rotational movement about said axis to a plane that is substantially parallel to said planar surface of said substrate.
19 . A MEMS device as claimed in claim 16 wherein said parallelogram arrangement is configured to collapse when subjected to a drive signal to enable anti-phase motion of said first and second movable masses, and said parallelogram arrangement is constrained to a non-collapsed configuration when subjected to an external vibration signal.
20 . A MEMS device as claimed in claim 16 wherein said drive direction and said second direction are substantially parallel to said planar surface of said substrate.