MEMS switches in an integrated circuit package
Methods and systems for MEMS switches fabricated in an integrated circuit package are disclosed and may include controlling switching of RF components, and signals handled by the RF components, within an integrated circuit. One or more MEMS switch arrays embedded within a multi-layer package bonded to the integrated circuit may be utilized for the switching and signal control. The RF components and one or more MEMS switch arrays may be integrated in the multi-layer package. The RF components may be electrically coupled to the integrated circuit via the one or more MEMS switch arrays. The MEMS switch arrays may be electrostatically or magnetically activated. The RF components may be coupled to one or more capacitor arrays in the integrated circuit. The RF components may include transformers, inductors, transmission lines, microstrip and/or coplanar waveguide filters and/or surface mount devices. The integrated circuit may be coupled to the multiple-layer package utilizing a flip-chip bonding technique.
1. A wireless communication system comprising:
a multi-layer package bonded to an integrated circuit, wherein said multi-layer package comprises an RF component and a MEMS switch array, and wherein said RF component is electrically coupled to said integrated circuit via said MEMS switch array;
wherein said RF component is coupled to a capacitor array within said integrated circuit, and wherein said MEMS switch array is magnetically activated.
2. The wireless communication system of claim 1 , wherein said RF component is tuned by said MEMS switch array.
3. The wireless communication system of claim 1 , wherein said RF component is tuned by said integrated circuit.
4. The wireless communication system of claim 1 , wherein said RF component is switched by said MEMS switch array.
5. The wireless communication system of claim 1 , wherein said RF component is switched by said integrated circuit.
6. The wireless communication system of claim 1 , wherein said MEMS switch array is electrostatically activated.
7. The wireless communication system of claim 1 , wherein said RF component comprises a transformer.
8. The wireless communication system of claim 1 , wherein said RF component comprises an inductor.
9. The wireless communication system of claim 1 , wherein said RF component comprises a transmission line.
10. The wireless communication system of claim 1 , wherein said RF component comprises a microstrip filter.
11. The wireless communication system of claim 1 , wherein said RF component comprises a coplanar filter.
12. The wireless communication system of claim 1 , wherein said RF component comprises a surface mount device.
13. The wireless communication system of claim 1 , wherein said integrated circuit is coupled to said multiple-layer package as a flip-chip.
14. A method comprising:
in a wireless system, controlling switching of an RF component and signals handled by said RF component within an integrated circuit by a MEMS switch array integrated in a multi-layer package;
wherein said RF component is coupled to a capacitor array integrated in said multi-layer package, said capacitor array being within said integrated circuit.
15. The method of claim 14 , wherein said MEMS switch array is magnetically activated.
16. The method of claim 14 , wherein said RF component is tuned by said MEMS switch array.
17. The method of claim 14 , wherein said RF component is tuned by said integrated circuit.
18. The method of claim 14 , wherein said RF component comprises a transformer.
19. The method of claim 14 , wherein said RF component comprises an inductor.
20. The method of claim 14 , wherein said MEMS switch array is electrostatically activated.