REDUCTION OF EDGE CHIPPING DURING WAFER HANDLING
Methods and systems for reinforcing the periphery of a semiconductor wafer bonded to a carrier are disclosed. In one embodiment, additional adhesive is applied to the semiconductor wafer prior to bonding. The additional adhesive seeps into a crevice between the carrier and wafer and provides reinforcement. In another embodiment, adhesive is applied to the crevice by a dispenser after the wafer is bonded to the glass carrier.
1 - 17 . (canceled)
18 . A system for reducing edge chipping of a semiconductor wafer during processing, comprising:
a motor;
a rotatable shaft mechanically linked to said motor;
a chuck affixed to said shaft, said chuck configured to hold a glass-wafer structure, the glass-wafer structure comprising a crevice at the periphery of the glass-wafer structure; and
a dispenser disposed to dispense fill material into the crevice.
19 . The system of claim 18 , wherein the dispenser comprises an extruding applicator.
20 . The system of claim 18 , wherein the dispenser comprises a brush applicator.