IP Library Granted Patent US 9,362,267
Granted Patent B2
US 9,362,267 · App. 13/780,436 · Granted Jun 7, 2016

Group III-V and group IV composite switch

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Quick Facts
Patent No.
US 9,362,267
App. No.
13/780,436
Granted
Jun 7, 2016
Kind
B2
Abstract

In one implementation, a group III-V and group IV composite switch includes a group IV transistor in a lower active die, the group IV transistor having a source and a gate situated on a bottom side of the lower active die. The group III-V and group IV composite switch also includes a group III-V transistor in an upper active die stacked over the lower active die, the group III-V transistor having a drain, a source, and a gate situated on a top side of the upper active die. The source of the group III-V transistor is electrically coupled to a drain of the group IV transistor using a through-semiconductor via (TSV) of the upper active die.

Claims (14)

1. A composite switch comprising:

a group IV transistor in a lower active die, a source and a gate of said group IV transistor being situated on a bottom side of said lower active die;

a group III-V transistor in an upper active die stacked over said lower active die, a drain, a source, and a gate of said group III-V transistor being situated on a top side of said upper active die;

said source of said group III-V transistor being electrically coupled to a drain of said group IV transistor using a through-semiconductor via (TSV) of said upper active die;

a source contact of said group III-V transistor formed directly on top of a drain of said group IV transistor.

2. The composite switch of claim 1 , wherein said group IV transistor is a vertical group IV transistor.

3. The composite switch of claim 1 , wherein said TSV does not reach a bottom side of said upper active die.

4. The composite switch of claim 3 , wherein said TSV reaches a highly conductive substrate in said upper active die, said highly conductive substrate being in electrical contact with said drain of said group IV transistor.

5. The composite switch of claim 1 , wherein said TSV reaches a bottom side of said upper active die.

6. The composite switch of claim 1 , wherein said group III-V transistor is a normally ON transistor and said composite switch is configured to be normally OFF.

7. The composite switch of claim 1 , wherein said group III-V transistor is a high-voltage (HV) transistor and said group IV transistor is a low-voltage (LV) transistor.

8. The composite switch of claim 1 , wherein said group III-V transistor is a III-Nitride high electron mobility transistor (III-Nitride HEMT).

9. The composite switch of claim 1 , wherein said group transistor comprises gallium nitride (GaN).

10. The composite switch of claim 1 , wherein said group IV transistor comprises silicon.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Apr 13, 2016
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.; INTERNATIONAL RECTIFIER CORPORATION; INTERNATIONAL RECTIFIER CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 038463/0859 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2013
From: BRIERE, MICHAEL A.; MCDONALD, TIM
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 029908/0412 →