Method of manufacturing a sensor
A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.
1. A method for manufacturing a sensor comprising:
at least partially encapsulating a sensor element using a first encapsulation molding process to form a sensor housing;
coupling the sensor element to a support element; and
at least partially encapsulating the sensor housing and the support element together using a second encapsulation molding process.
2. The method of claim 1 , wherein the coupling further comprises connecting the sensor element to the support element using a holding device of the sensor element.
3. The method of claim 2 , wherein the coupling further comprises holding the holding device of the sensor element using at least one clamping device of the support element.
4. The method of claim 2 , wherein the coupling further comprises embracing the holding device from an outside of the holding device.
5. The method of claim 1 , wherein the coupling occurs before the encapsulating of the sensor housing and the support element.
6. The method of claim 1 , further comprising positioning the support element in an injection molding tool using at least one positioning element after the coupling of the sensor element to the support element.