Heat pipe in overmolded flip chip package
View Patent ↗The present invention is an improvement in a molded semiconductor package and the method for its manufacture. The package comprises a substrate, a semiconductor die mounted on the substrate, a molding compound encircling the die on the substrate, a lid on the molding compound, and a heat pipe extending between the semiconductor die and the lid. Preferably, the heat pipe is formed so that it encircles the die. The package is assembled by mounting the die on the substrate, applying the molding compound to the substrate while a channel is formed in the molding compound adjacent the semiconductor die, inserting a heat pipe material in the channel, and mounting the lid on the molding compound and the heat pipe material.
1. A structure comprising:
a substrate,
a semiconductor die mounted on the substrate;
a molding material encircling the semiconductor die;
a lid on the molding material,
a heat pipe extending between the semiconductor die and the lid in a channel in the molding material; and
wherein the channel encircles the semiconductor die and the heat pipe contacts the lid and encircles and contacts an upper part of all sides of the semiconductor die.
2. The structure of claim 1 wherein the semiconductor die is rectangular having four sides and the heat pipe extends between an upper part of each side of the die and the lid.
3. The structure of claim 1 wherein the lid is a heat conductor.
4. The structure of claim 1 wherein the lid is secured to the substrate.
5. The structure of claim 1 wherein the lid is shaped to surround the die, molding material and heat pipe.
6. The structure of claim 1 wherein the molding material is a biphenyl epoxy resin or a cresol novolac resin.
7. The structure of claim 1 wherein the heat pipe comprises a mixture of ammonia, methanol and water.
8. A structure comprising:
a substrate;
a lid secured to the substrate and defining an interior region between the substrate and the lid;
a semiconductor die mounted on the substrate within the interior region;
a molding material in the interior region that contacts the substrate, the lid and a lower part of the semiconductor die; and
a heat pipe contacting an upper part of the semiconductor die and an interior surface of the lid.
9. The structure of claim 8 wherein the heat pipe is annular in shape and extends between all sides of the semiconductor die and the lid.
10. The structure of claim 8 wherein the semiconductor die is rectangular and the heat pipe is rectangular in shape and extends between each side of the die and the lid.
11. The structure of claim 8 wherein the lid is a heat conductor.
12. The structure of claim 8 wherein the molding material is a biphenyl epoxy resin or a cresol novolac resin.
13. The structure of claim 8 wherein the heat pipe comprises a mixture of ammonia, methanol and water.
14. A structure comprising:
a substrate;
a lid secured to the substrate and defining an interior region between the substrate and the lid;
a semiconductor die mounted on the substrate within the interior region;
a molding material encircling the semiconductor die in the interior region and contacting a lower part of the semiconductor die; and
a heat pipe encircling the semiconductor die and contacting an upper part of the semiconductor die and an interior surface of the lid.
15. The structure of claim 14 wherein the heat pipe is annular in shape and extends between all sides of the semiconductor die and the lid.
16. The structure of claim 14 wherein the semiconductor die is mounted on the substrate with its front surface facing the substrate.
17. The structure of claim 14 wherein the lid is a heat conductor.
18. The structure of claim 14 wherein the molding material is a biphenyl epoxy resin or a cresol novolac resin.
19. The structure of claim 14 wherein the heat pipe comprises a mixture of ammonia, methanol and water.