Assignment of Assignor's Interest

Recorded: 2013-03-06 Pages: 5

Assignor

HATA, WILLIAM Y.

Executed: 2013-02-28

Assignee

ALTERA CORPORATION

101 INNOVATION DRIVE, SAN JOSE, CALIFORNIA, 95134

Covered Properties (2)

Heat Pipe in Overmolded Flip Chip Package

Patent: 9,202,772 →

Application: 13/781,278 →

Publication: US 2014/0239487

Heat Spreading in Molded Semiconductor Packages

Patent: 9,870,978 →

Application: 13/781,368 →

Publication: US 2014/0239483

Related Assignments (1)

Other recorded transfers of the patents in this record — the chain of ownership.