IP Library Granted Patent US 8,872,106
Granted Patent B2
US 8,872,106 · App. 13/789,346 · Granted Oct 28, 2014

Pattern measuring apparatus

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,872,106
App. No.
13/789,346
Granted
Oct 28, 2014
Kind
B2
Abstract

An object of the present invention is to provide a pattern measuring apparatus which performs high-accuracy concavity/convexity determination (e.g., distinguishing between a line segment and space) while simultaneously reducing the dose of a beam falling onto a pattern to be measured. To attain the object, this invention proposes a pattern measuring apparatus which specifies a pattern in a measurement object area by scanning a tilted bean with respect to another area different from the measurement object area and then performs measurement based on the pattern-specifying result. With such arrangement, it becomes possible to perform measurement without the risk of wrong pattern designation while lowering the dose of a beam hitting the measurement object area.

Claims (20)

1. A pattern measuring apparatus, comprising:

an arithmetical unit configured to perform, by way of a programmed processor:

determining a pattern size by using a signal to be obtained based on scanning of a charged particle beam emitted from a charged particle source; and

a beam tilting deflector for irradiating the charged particle beam while tilting this beam with respect to an ideal light axis thereof,

wherein the arithmetical unit is configured to perform, by way of the programmed processor:

specifying a kind of a pattern formed on a sample based on a signal obtained by obliquely scanning the beam in an area of the sample being different from an area used to obtain the pattern size.

2. The pattern measuring apparatus according to claim 1 , wherein the beam tilting deflector specifies the kind of a pattern formed on the sample based on a signal obtained when irradiating the tilted beam in an area in which is formed the same kind of pattern as that of the area used to obtain the pattern size.

3. The pattern measuring apparatus according to claim 1 , wherein the beam tilting deflector deflects the charged particle beam in such a manner that the charged particle beam goes away from the light axis of an objective lens.

4. The pattern measuring apparatus according to claim 3 , wherein the beam tilting deflector switches between a tilted state and a non-tilted state of the charged particle beam during scanning of a one frame by means of a scanning deflector which is for scanning the charged particle beam.

5. The pattern measuring apparatus according to claim 1 , wherein the beam tilting deflector is a deflector for moving a visual field.

6. The pattern measuring apparatus according to claim 5 , wherein the arithmetical unit specifies the kind of the pattern based on a signal obtained in an area with the visual field having been moved by a predetermined distance from the area in which the pattern size is obtained by the deflector for moving the visual field.

7. The pattern measuring apparatus according to claim 1 , wherein the arithmetical unit determines whether the pattern formed on the sample is a line pattern or a space.

8. The pattern measuring apparatus according to claim 1 , wherein the arithmetical unit determines whether the pattern formed on the sample is a core gap or a spacer gap.

9. A pattern measuring apparatus comprising:

an arithmetical unit configured to perform, by way of a programmed processor:

determining a pattern size by using a signal to be obtained based on scanning of a charged particle beam emitted from a charged particle source; and

a beam tilting deflector for irradiating the charged particle beam while tilting this beam with respect to an ideal light axis thereof,

wherein the arithmetical unit is configured to perform, by way of the programmed processor:

specifying a kind of a pattern formed on a sample based on a signal obtained by obliquely scanning the beam in an area of the sample being different from an area used to obtain the pattern size, thereby to measure the pattern thus specified.

10. The pattern measuring apparatus according to claim 9 , wherein the arithmetical unit determines that the pattern formed on the sample is which one of a line, a space, a core gap and a spacer gap.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2013
From: NISHIHAMA, HIROSHI; MAEDA, TATSUYA; IKEDA, MITSUJI; KOYAMA, SUSUMU
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 030629/0985 →