LEAD FRAME FOR SEMICONDUCTOR PACKAGE
A lead frame having a die support area for supporting a semiconductor die, a plurality of leads surrounding the die support area, and a dam bar connecting adjacent leads. The dam bar has a dummy tab between adjacent ones of the leads that transversely extends towards the die support area. The presence of the dummy tab reduces the volume of mold compound between the lead frame leads and thus, when the lead frame is cut via punching, only the lead frame is cut and not the molding material. This reduces mechanical stress during singulation significantly and as a result, the occurrence of package cracking is reduced. In addition, less mold compound at the dam bar inter-lead reduces debris during cutting, which in turn reduces debris from contaminating the package.
1 . A lead frame, comprising:
a die support area for supporting a semiconductor die;
a plurality of leads surrounding the die support area;
a dam bar connecting adjacent leads, wherein dam bar inter-lead areas are formed between adjacent ones of the leads; and
a plurality of dummy tabs located between adjacent leads and extending transversely towards the die support area, wherein during a molding operation, the dummy tab reduces a volume of molding material in the dam bar inter-lead area.
2 . The lead frame of claim 1 , wherein each lead has an inner lead portion and an outer lead portion, and the dam bar connects the adjacent leads at a location between the inner lead portion and the outer lead portion.
3 . The lead frame of claim 1 , wherein each lead has an outer end, and the dam bar connects the adjacent leads at the outer ends.
4 . The lead frame of claim 1 , wherein there is a gap between the dummy tab and the adjacent leads.
5 . The lead frame of claim 1 , wherein a length of the dummy tab is less than a length of the adjacent leads.
6 . A method of assembling a semiconductor device, comprising:
providing a lead frame comprising:
a die support area for supporting a semiconductor die,
a plurality of leads surrounding the die support area, wherein each lead has a die connect area,
a dam bar connecting adjacent ones of the leads, wherein , and
a plurality of dummy tabs located between adjacent leads and extending transversely from the dam bar towards the die support area;
attaching a semiconductor die to the die support area of the lead frame;
electrically connecting the die connect area of the leads to the semiconductor die;
encapsulating the semiconductor die and the die connect area of the leads with a molding material, wherein the dummy tab reduces a volume of molding material in the dam bar inter-lead areas; and
removing the dam bar and the dummy tab.
7 . The method of assembling a semiconductor device of claim 6 , wherein each lead of the lead frame has an inner lead portion and an outer lead portion, and the dam bar connects the adjacent leads at a location between the inner lead portion and the outer lead portion.
8 . The method of assembling a semiconductor device of claim 6 , wherein each lead of the lead frame has an outer end, and the dam bar connects the adjacent leads at the outer ends.
9 . The method of assembling a semiconductor device of claim 6 , wherein there is a gap between the dummy tab and the adjacent leads.
10 . The method of assembling a semiconductor device of claim 6 , wherein the electrically connecting step comprises electrically connecting the leads with the semiconductor die with bond wires.
11 . The method of assembling a semiconductor device of claim 6 , wherein the electrically connecting step comprises electrically connecting the leads with the semiconductor die with solder bumps.
12 . The method of assembling a semiconductor device of claim 6 , wherein the removing step comprises cutting the dam bar and the dummy tab with a punch.
13 . The method of assembling a semiconductor device of claim 6 , wherein the removing step comprises removing the dam bar and the dummy tab with a saw.
14 . The method of assembling a semiconductor device of claim 6 , wherein the removing step comprises removing the dam bar and the dummy tab by laser cutting.
15 . The method of assembling a semiconductor device of claim 6 , wherein the removing step comprises etching the dam bar and the dummy tab.