Methods and devices for fabricating and assembling printable semiconductor elements
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
1. An electrical device comprising:
a first electrode;
a second electrode; and
a printable semiconductor element positioned in electrical contact with said first and second electrodes, said printable semiconductor element comprising a unitary inorganic semiconductor structure and wherein said printable semiconductor element provides a fill factor between said first and second electrodes greater than or equal to about 20%.
2. The electrical device of claim 1 wherein said printable semiconductor element provides a fill factor between said first and second electrodes greater than or equal to about 50%.
3. The electrical device of claim 1 wherein said printable semiconductor element comprises a microstructured printable semiconductor element or a nanostructured printable semiconductor element.
4. The electrical device of claim 1 wherein said printable semiconductor element has a shape selected from the group consisting of
a ribbon;
a platelet;
a column;
a cylinder;
a disc; and
a block.
5. The electrical device of claim 1 further comprising at least one additional printable semiconductor element, wherein additional printable semiconductor elements are in electrical contact with said first and second electrodes.
6. A method for fabricating a printable semiconductor element connected to a mother wafer via one or more alignment maintaining elements, said method comprising the steps of:
providing said mother wafer having an external surface, said mother wafer comprising an inorganic semiconductor material;
masking a selected region of said external surface by applying a mask;
etching said external surface of said mother wafer, thereby generating a relief structure and at least one exposed surface of said mother wafer, wherein said relief structure has a masked side and one or more unmasked sides;
etching said at least one exposed surface of said mother wafer; and
stopping etching of said at least one exposed surface so that complete release of said relief structure is prevented, thereby fabricating said printable semiconductor element connected to said mother wafer via one or more alignment maintaining elements.
7. The method of claim 6 wherein said printable semiconductor element has a peanut shape with a first end and a second end, wherein said alignment maintaining elements connect said first and second ends of said printable semiconductor element to said mother wafer.
8. The method of claim 6 wherein said printable semiconductor element has a ribbon shape with a first end and a second end, wherein said alignment maintaining elements connect said first and second ends of said printable semiconductor element to said mother wafer.