Micro-plasma generation using micro-springs
An ionic wind engine unit for cooling semiconductor circuit assemblies includes a curved micro-spring and an associated electrode that are maintained apart at an appropriate gap distance such that, when subjected to a sufficiently high voltage potential (i.e., as determined by Peek's Law), current crowding at the spring's tip portion creates an electrical field that sufficiently ionizes neutral molecules in a portion of the air-filled region surrounding the tip portion to generate a micro-plasma event. In one engine type the electrode is a metal pad, and in a second engine type the electrode is a second micro-spring. Ionic wind cooling is generated, for example, between an IC die and a base substrate in a flip-chip arrangement, by controlling multiple engines disposed on the facing surfaces to produce an air current in the air gap region separating the IC device and base substrate.
1. A system for generating a micro-plasma, the system comprising:
a base substrate having a flat surface;
a curved micro-spring including an anchor portion disposed parallel to the flat surface of the base substrate, a curved body portion having a first end integrally connected to the anchor portion and curved away from the flat base surface, and a tip portion integrally connected to a second end of the curved body portion, the anchor, body and tip portions comprising an electrically conductive material, wherein the tip portion is fixedly disposed in an air-filled region located above the flat surface;
an electrode disposed on or above the flat surface adjacent to the tip portion of the micro-spring such that the tip portion is maintained at a fixed gap distance from the electrode; and
a voltage supply coupled to the first electrode and to the anchor portion of the curved micro-spring, the voltage supply including means for generating a plasma-generating voltage across the fixed gap distance between the tip portion of the micro-spring and the electrode such that current crowding at the tip portion creates an electrical field that sufficiently ionizes neutral molecules in a portion of the air-filled region surrounding the tip portion to generate a micro-plasma,
wherein the electrode comprises a second curved micro-spring attached to the flat surface of the base substrate adjacent to said curved micro-spring such the fixed gap distance is defined between said tip portion and a second body portion of said second micro-spring; and
wherein said voltage supply comprises means for applying said plasma-generating voltage across the fixed gap distance between said micro-spring and the second micro-spring such that said micro-plasma is directed substantially parallel to the flat surface of the base substrate,
further comprising a third curved micro-spring attached to the flat surface of the base substrate adjacent to said second curved micro-spring such the second micro-spring is disposed between said curved micro-spring and the third micro-spring,
wherein said voltage supply comprises means for applying said plasma-generating voltage across the micro-spring and the second micro-spring during a first time period such that said micro-plasma is generated between the first and second micro-springs during the first time period, and for applying said plasma-generating voltage across the second micro-spring and the third micro-spring during a second time period such that a second micro-plasma is generated between the second and third micro-springs during a second time period.
2. The system of claim 1 , wherein the curved micro-spring comprises a spring metal portion including one of molybdenum (Mo), molybdenum-chromium (MoCr) alloy, tungsten (W), a titanium-tungsten alloy (Ti:W), chromium (Cr), copper (Cu), nickel (Ni) and nickel-zirconium alloy (NiZr)), and an outer layer comprising gold (Au).
3. The system of claim 1 , wherein the voltage supply comprises means for generating said plasma-generating voltage at 250V or greater.
4. The system of claim 1 , wherein the electrode is disposed on a second substrate fixedly disposed over the base substrate such that said air-filled region comprises a channel defined between the flat surface and the second substrate.
5. The system of claim 4 , wherein base substrate comprises a package base and second substrate comprises an integrated circuit (IC) die.
6. The system of claim 4 , further comprising a second electrode disposed on the second substrate adjacent to and spaced from the electrode and maintained at a second fixed gap distance from the tip portion of the curved micro-spring,
wherein said voltage supply comprises means for applying said plasma-generating voltage across the fixed gap distance between the tip portion of the micro-spring and the electrode during a first time period such that said micro-plasma is generated having a first glowing direction during the first time period, and for applying said plasma-generating voltage across the second fixed gap distance between the second tip portion of the micro-spring and the second electrode during a second time period such that a second micro-plasma between said micro-spring and said second electrode is generated having a second glowing direction during the second time period, the second glowing direction being different from the first glowing direction.
7. The system of claim 4 , further comprising:
a second electrode disposed on the second substrate;
a second curved micro-spring including an anchor portion attached to the flat surface of the base substrate and a second tip portion fixedly disposed in said air-filled channel region adjacent to the second electrode such that the second tip portion is maintained at a second fixed gap distance from the second electrode,
wherein said voltage supply comprises means for applying said plasma-generating voltage across the fixed gap distance between the tip portion of the micro-spring and the electrode during a first time period such that said micro-plasma is generated during the first time period, and for applying said plasma-generating voltage across the second fixed gap distance between the second tip portion of the second micro-spring and the second electrode during a second time period such that a second micro-plasma is generated between the second tip portion and the second electrode during a second time period, whereby said first and second micro-plasma events generate an air current in said air-filled channel region.
8. The system of claim 1 , further comprising a second substrate fixedly disposed over the base substrate such that said air-filled region comprises a channel defined between the flat surface and the second substrate, wherein said voltage supply comprises means for generating said micro-plasma and said second micro-plasma such that an ionic wind air current is generated in said air-filled channel region.
9. The system of claim 8 , wherein base substrate comprises a package base and second substrate comprises an integrated circuit (IC) die.
10. The system of claim 8 , wherein base substrate comprises a package base and said IC device comprises an integrated circuit (IC) die.
11. The system of claim 1 , further comprising:
an integrated circuit (IC) device mounted over the base substrate such that a non-active surface of the IC device faces away from the base substrate, and an active surface of the IC device faces the flat surface of the base substrate whereby said air-filled region comprises a channel defined between the flat surface and the active surface, the IC device including a contact pad that is disposed on the active surface and is coupled to an integrated circuit disposed on said IC device;
wherein the third curved micro-spring is attached to the flat surface of the base substrate such that an anchor portion of said third curved micro-spring is electrically connected to an associated conductor disposed on said base substrate, and such that a tip portion of said third curved micro-spring is electrically connected to said contact pad.
12. A circuit assembly comprising:
a first substrate having an upper surface and including a first contact pad disposed on the upper surface;
a second substrate mounted on the first substrate such that a lower surface of the second substrate faces the upper surface of the first substrate whereby an air-filled channel region is defined between the upper surface and the lower surface, the second substrate including a second contact pad that is disposed on the lower surface and is coupled to an integrated circuit disposed on said second substrate;
at least one curved interconnect micro-spring disposed in an air-filled channel region defined between the upper surface of the first substrate and the lower surface of the second substrate, the interconnect micro-spring including a first end portion that is electrically connected to the second contact pad, a second end portion that is electrically connected to the first contact pad, and a curved body portion extending between the first and second end portions; and
an ionic-wind engine including:
a curved anode micro-spring including an anchor portion attached to one of the upper surface of the first substrate and the lower surface of the second substrate, a curved body portion having a first end integrally connected to the anchor portion and curved away from the flat base surface, and a tip portion integrally connected to a second end of the curved body portion, the anchor, body and tip portions comprising an electrically conductive material, wherein the tip portion is fixedly disposed in the air-filled channel region, and
an electrode structure disposed on one of the upper surface of the first substrate and the lower surface of the second substrate, and maintained at a fixed gap distance from the tip portion of the anode micro-spring.
13. The circuit assembly according to claim 12 ,
wherein the anode micro-spring is attached to the upper surface of the first substrate, and
wherein the electrode structure comprises a second curved micro-spring attached to the upper surface of the first substrate adjacent to said anode curved micro-spring such the fixed gap distance is defined between said tip portion and a second body portion of said second micro-spring.
14. The circuit assembly according to claim 12 ,
wherein the anode micro-spring is attached to the upper surface of the first substrate, and
wherein the electrode structure comprises a metal pad disposed on the lower surface of the second substrate.
15. The circuit assembly according to claim 14 , further comprising a second interconnect micro-spring having an anchor portion attached to the upper surface of the first substrate and having a tip portion contacting the metal pad disposed on the lower surface of the second substrate.
16. The circuit assembly according to claim 14 , further comprising a second ionic engine unit comprising:
a second anode micro-spring attached to the upper surface of the first substrate, and
a second electrode structure comprises a metal pad disposed on the lower surface of the second substrate.
17. The circuit assembly of claim 12 , wherein first substrate comprises a package base substrate and the second substrate comprises an integrated circuit (IC) die.
18. The circuit assembly of claim 12 , further comprising a third substrate mounted on the second substrate, and a second ionic-wind engine disposed in a gap separating the second and third substrates.